IEEE ESTC 2026
SEPTEMBER 9–11, 2026 Helsinki, Finland
2026 ESTC Heterogeneous Integration Roadmap (HIR) Workshop
8:30am – 12:45pm
With the desire to shrink electronic systems the heterogeneous integration of chiplets and passives enables engineers to innovate. Technical working group members of the Heterogeneous Integration Roadmap have organized a workshop on a subset of technologies which enable these complex components. A brief introduction to the roadmap will start the session. The subsequent two sessions will primarily focus on automotive systems with one session on thermal management and the other on system-in-package technologies/design. A panel discussion on the interdependencies between thermal design and other advanced packaging design considerations will be held during which attendees can contribute to the discussion.
Registration
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Program online!
This year’s IEEE ESTC Conference will feature 105 oral and 108 poster presentations highlighting new developments in advanced packaging, wafer-level packaging, reliability of electronic devices and power electronics, to name but a few topics. As in previous years, the conference papers will be published in the conference proceedings and in the IEEE Xplore database.