The 11th IEEE ESTC

SEPTEMBER 9–11, 2026 | HELSINKI, FINLAND

Platinum Sponsors
AEMtec
Gold Sponsors
Pactech
ASE
Silver Sponsors
ERS
Besi
KYE
Infineon
Schmid
LPKF
Schott
Alter
HIR
Business Finland

Event Sponsors IEEE ESTC 2024

The 11th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026)

The 11th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026) is the premier international event in the field of electronics packaging and system integration. The conference is organized every two years in Europe and is supported by IEEE-EPS in association with IMAPS Europe. The 11th IEEE ESTC will be taking place in Helsinki, Finland.

10th IEEE ESTC Conference – A Resounding Success!

Review and pictures

IEEE ESTC 2024 Best Paper, Best Poster and Student Travel Awards

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Mission

Organized by IEEE-EPS (former CPMT) since 2006, the IEEE ESTC conference series is the premier venue for academics and industry to present and discuss the latest developments in electronics packaging.

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Topics

IEEE ESTC is covering a wide range of up-to-date topics in electronics packaging and system integration. Presentations of leading edge research and development results related to those topics are welcome.

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Newsletter

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