Event Sponsors IEEE ESTC 2026

11th IEEE ESTC Conference – A Record-Breaking Anniversary Edition

Helsinki | September 9–11, 2026

The 11th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026) brought the international electronics packaging and system-integration community together at Finlandia Hall in Helsinki for three days of technical exchange, networking, and discussion. The 2026 edition also marked 20 years since the first ESTC was held in Dresden in 2006 and achieved the largest attendance in the conference’s history.

A total of 470 participants from 31 countries joined the conference, with an exceptionally balanced mix of 50.0% from industry and 44.7% from academia. The technical program featured 107 oral presentations in 36 technical sessions, 80 poster presentations in four poster sessions.

Program Highlights:

• Seven Professional Development Courses (PDCs)
• Six keynote presentations covering topics across semiconductor technologies, advanced packaging, photonics, manufacturing, sustainability, and future directions in electronics system integration
• The IEEE EPS Heterogeneous Integration Roadmap Workshop
• Five Special Sessions
• Panel Discussion on Sustainable Electronics
• The ESTC Student Competition
• 37 exhibitors, making the exhibition an important meeting point throughout the conference

Beyond the technical program, the social events offered plenty of opportunities to continue discussions in a more informal setting. The Welcome Reception brought the community together at Finlandia Hall after the first conference day, while the Conference Dinner at the historic Hilton Helsinki Kalastajatorppa provided a memorable setting for networking and celebrating ESTC’s 20-year history.

A particularly special moment during the Dinner was the recognition of Prof. Klaus-Juergen Wolter, who established the ESTC conference together with his team and served as General Chair of the first edition in 2006, and Prof. Thomas Zerna, the only person to have served on the Organizing Committee of every ESTC conference throughout its 20-year history. Both were honored for their exceptional contributions to the ESTC community. Last not least, Prof. Karlheinz Bock, himself a former ESTC General Chair, was presented with the IEEE Region 8 Award for significant leadership and impact within IEEE Region 8.

Special congratulations also go to the winners of the Best Paper Award, Samuel Suhardi and his co-authors, for “Heterogeneous Integration of Die to Wafer Microbumps Bonding and Hybrid Cu Bonding on a Single Interposer,” and the winners of the Best Poster Paper Award, Arvind Kumar and his co-authors, for “Next-generation Cryogenic Refrigeration System Enabled by Superconducting Tunnel Junctions.”

The organizers would like to thank all keynote speakers, authors, presenters, session chairs, PDC instructors, panelists, reviewers, exhibitors, sponsors, and participants who contributed to making IEEE ESTC 2026 in Helsinki such a successful anniversary edition.