Event Sponsors

The 10th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2024)

The 10th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2024) is the premier international event in the field of electronics packaging and system integration. The conference is organized every two years in Europe and is supported by IEEE-EPS in association with IMAPS Europe. The 10th IEEE ESTC will be taking place in Berlin, Germany.

Program online!

This year’s IEEE ESTC Conference will feature 120 oral and 50 poster presentations, 4 keynotes, 4 professional development courses, a HIR Workshop, 5 special sessions, and a panel on “Chiplet Architectures for Automotive”.

Side Events

September 9-10, 2024, Berlin, Germany
3rd EuroPAT-Workshop “Semiconductor Packaging Manufacturing in Europe – Growing or Vanishing?”
Organized by SEMI Europe, Hosted by Swissbit Germany AG
More Info

September 10, 2024, Berlin, Germany
Workshop “Direct Write Technology in Industrial R&D, Electronics System Integration, and Packaging”
Organized by Heidelberg Instruments and Fraunhofer IZM
More Info

Registration

Register now for IEEE ESTC and save you space in one of the professional development courses on Wednesday, September 11, 2024.

Venue

The IEEE ESTC 2024 Conference will be held at the MOA Berlin Hotel in Berlin, one of the biggest event locations in the city.

Exhibitors and Sponsors

The IEEE ESTC 2024 provides very attractive sponsorship and exhibition opportunities. The conference is the perfect place for you to present your products and services to more than 300 engineers, managers, and decision makers.