The 11th IEEE ESTC
SEPTEMBER 9–11, 2026 | HELSINKI, FINLAND
Keynotes
Wednesday, September 9, 2026
6G Wireless Telecommunication challenges to semiconductors and SoCs
Sami Repo
MN SoC Chief Technology Officer, Nokia Solutions & Networks
Mr. Sami Repo has served as MN SoC Chief Technology Officer at Nokia Solutions & Networks Oy since February 2025. With over 25 years of experience in wireless digital hardware design and embedded systems, he has held key leadership roles in SoC development, architecture, and hardware R&D. Throughout his career, Mr. Repo has worked mainly at wireless telecommunication semiconductor side. First in Nokia Mobile Phones where he began his professional journey and held various positions, as well as at Broadcom and Renesas Mobile Corporation, before joining back to Nokia Networks in 2013. He holds an M.Sc. in Electrical and Information Engineering from the University of Oulu.
Abstract:
A view to 6G Mobile Telecommunications space, with semiconductor needs and challenges in it.
The Future of Computing – Let's Make It Quantum
Dr. Jan Goetz
IQM Quantum Computers
Dr. Jan Goetz is the CEO & Co-Founder of IQM Quantum Computers, a global leader in quantum computing. Jan Goetz did his doctorate on superconducting quantum circuits at TU Munich and worked as a Marie-Curie Fellow in Helsinki at Aalto University, where he holds the title of docent. He has raised over $600M of capital for the company together with his co-Founders since the company was founded in 2018. He serves as an EIC ambassador and holds a Board seat in the European Quantum Industry Consortium QuIC. He is a member of the German Federal Economic Senate, EIC Scaling Club Council and the Hall of Future. He is also a Digital Leader and Global Innovator at the WEF.
Abstract:
This talk will describe the current state of quantum computing and roadmaps to achieve commercial quantum advantage.
Thursday, September 10, 2026
Next-Generation Silicon Photonics powering future AI Compute
Joris Van Campenhout
Program director optical input/output (I/O), imec
Joris Van Campenhout is Fellow Silicon Photonics and senior director of imec’s industry-affiliation R&D program on Optical I/O, which targets the development of scalable short-reach optical interconnect technology based on silicon photonics. Prior to joining imec in 2010, he was with IBM’s TJ Watson Research Center (USA), where he developed silicon electro-optic switches. He obtained a PhD degree in Electrical Engineering from Ghent University (Belgium) in 2007, for his work on heterogeneous integration of InP lasers on silicon. Joris has been granted 15+ patents and has authored or co-authored over 100 papers in the field of silicon integrated photonics, which have received 15000+ citations.
Abstract:
The scaling of future AI/ML clusters hinges increasingly on pushing optical interconnect technology deep into the system. In this presentation, we will outline our vision for deeply integrating optical interconnects into the package, interposer, and wafer level, leveraging scaled Silicon Photonics, novel materials and advanced 3D technologies to implement high-density sub-pJ/bit optical transceivers. We will share some recent results from our ongoing research and development efforts on advanced optical devices, packaging and assembly.
