Conference Topics

ESTC is covering the following topics:

Advanced Packaging

Challenges and solutions in 3D integration, embedded structures, wafer level packaging, micro-bonding, TSVs, TEVs, advanced substrates and interposers

Materials for Interconnects and Packaging

New materials and processing – e.g. phase change materials, novel thermal interface material, low dimensional materials, metamaterials, self-organizing, piezoelectric, dielectric and memory materials, nanomaterials, advanced interconnection metallurgical materials and interconnects, adhesives in advanced interconnects

Optoelectronic Systems Packaging

Heterogeneous integration in Silicon Photonics, Cryogenic photonic packaging for quantum communication and computing, Advances on LiDARs, Photonic radars, OCT, on-chip solutions and packaging,   Thin glass for board, modules and panel-level-packaging, Wafer Level Packaging in Silicon Photonics, optical alignment techniques, assembly automation, reliability assessment of optical interconnects, Additive manufacturing and 3D-writing of optical interconnects

Assembly and Manufacturing Technologies

Novel assembly technologies, manufacturing aspects to novel packaging, wafer level processing

Design Tools and Modeling

Design and modelling techniques related to electronics system integration. This includes but is not limited to thermal, mechanical, electrical, multi-physics, and multi-scale modelling; Experimental validation of design and modelling techniques; Machine learning and digital twins, model-order reduction, and stochastic techniques; Co-Design for chip-package interactions and heterogeneous integration, reliability models, and prognostics and health management techniques.

Power Electronics System Packaging

High performance packaging (low RDS(on), low Rth, high temperature, fast-switching high-frequency compatible), passives integration and miniaturization, power embedding, very high voltage solutions, novel cooling solutions incl. double-sided cooling, integration aspects of wide bandgap power semiconductor devices (e.g. SiC, GaN, GaAs), reliability and prognostics

Advanced Technologies for Emerging Systems

Emerging packaging concepts and technologies for bio-electronics, microfluidics, wearable electronics and sensors/actuators, Additive Manufactering, Nanopackaging (nanoscaled materials, nanowires, nanointerconnects), Allotropes of carbon (CNTs, graphene, DLC, etc.)

Reliability of Electronic Devices and Systems

New results at different levels of system integration (chip contacts, packages, assemblies and subsystems),   Characterization and test, Failure diagnostics, Methodical and equipment developments, Upcoming challenges due to new system integration demands, Innovative packaging solutions for extended reliability requirements

Flexible, Printed and Hybrid Electronics

Flexible printed and additive materials, design, fabrication processes, components, devices, and electronics systems (e.g. sensors and actuators, PV and photodetectors, signage and displays, energy harvesting and storage, structural electronics, lab-on-chip) as well as flexible hybrid systems and processes integrating microelectronic components on flexible/stretchable substrate in the broad range of applications (e.g. biotech, space, automotive, consumer electronic, health, food and agriculture, environmental monitoring)

RF, mm-wave and THz Systems Packaging

Packaging technologies for RF, mm-wave and THz applications, Novel SiP approaches for mm-wave and THz array integration, High performance Chip-to-Package interconnects for mm-wave and THz SiPs, Advanced modeling and Co-simulation methodologies of mm-wave and THz SiPs, On-chip and on-package radiating elements & antennas, High accuracy PCB and assembly technologies for mm-wave and THz SiPs, Novel circuits for Built-in-self-test (BIST) of RF, mm-wave and THz SiPs

Global Education for Electronics

Educational development, open educational resources, massive open online courses; Game-based and problem-based learning; work-integrated learning methods; Distance learning, hybrid learning, life-long learning; STEM education, curriculum design; Cloud-based teaching tools; Student assessment, qualitative and quantitative analyses, interpolated testing methods

Sponsored by

Partner Conferences of ESTC

Sponsored by

Partner Conferences of ESTC