ESTC 2024
Technical Program Committee
The Technical Program Committee plays an important role in ensuring the quality of ESTC. Reviewing the submitted abstracts and papers and finally compiling an interesting and high-class technical program is only possible based on expert driven subcommittees.
The Technical Program Chair, coordinating the work of the subcommittees, changes from one ESTC to the next, while most of the subcommittee members already support ESTC for a long time. There is one subcommittee for each of the conference topics and one additional subcommittee responsible for the poster presentations.
Technical Program Chair for ESTC 2024
Tanja Braun, Fraunhofer IZM Berlin, Germany
Advanced Packaging Subcommittee
Chair: Rolf Aschenbrenner, Fraunhofer IZM Berlin, Germany
Co-Chair: Klaus Pressel, Infineon Technologies AG, Germany
Members:
Eric Beyne, IMEC, Belgium
Björn Böhme, Global Foundries Dresden, Germany
Beth Keser, Intel Germany
Steffen Kröhnert, ESPAT Consulting, Germany
Franck Murray, Murata, France
Ranjan Rajoo, Global Foundries, Singapore
Johannes Stahr, AT&S, Austria
Jan Vardaman, TechSearch, USA
Seungwook (Stewart) Yoon, Samsung, South Korea
Christophe Zinck, ASE, France
Marin Gheorghe, NANOM-MEMS, Romania
Karan Bhangaonkar, Intel Corporation, USA
Materials for Interconnects and Packaging Subcommittee
Chair: Johan Liu, Chalmers University of Technology, Göteborg, Sweden
Co-Chair: Glenn Ross, Aalto University, Finland
Members:
Ana Barar, University Politechnica Bucharest, Romania
Mihai Branzei, University Politechnica Bucharest, Romania
Liqiang Cao, Institute of Microelectronics, Chinese Academy of Sciences, China
Paul Conway, University of Loughborough
Brad Factor, ASE Group, France
Jan Felba, University of Wroclaw, Poland
Yifeng Fu, Chalmers University Göteborg, Sweden
Mihai Gabor, TU Cluj-Napoca; Romania
Helge Kristiansen, Conpart, Norway
Andreas Larsson, Tegma, Norway
James E. Morris, Portland State University, USA
Hiroshi Nishikawa, Osaka University, Japan
Assembly and Manufacturing Technologies Subcommittee
Chair: Erik Jung, Fraunhofer IZM, Germany
Co-Chair: David Whalley, University of Loughborough, UK
Members:
Knut E. Aasmundtveit, Vestfold Univ. College, Norway
Gabriel Chindris, Technical University of Cluj Napoca, Romania
Michel Garnier, STMicroelectronics, France
Attila Géczy, Budapest University of Technology and Economics, Hungary
David Henry, CEA LETI Grenoble, France
Hoang-Vu Nguyen, University of South-Eastern Norway, Norway
Machiel Peters, Philips B.V., The Netherlands
Vidya Jayaram, Intel Corporation, USA
Optoelectronic Systems Packaging Subcommittee
Chair: Giovanni Delrosso, VTT, Finland
Co-Chair: Henning Schröder, Fraunhofer IZM, Germany
Members:
Stéphane Bernabé, CEA LETI, France
Karlheinz Bock, TU Dresden, Germany
Ulrich Fischer-Hirchert, Univ. of Appl. Sci., Germany
Krzysztof Nieweglowski, TU Dresden, Germany
András Poppe, Budapest University of Technology and Economics, Hungary
Mark Shaw, ST Agrate, Italy
Maria Chiara Ubaldi, Fondazione CIFE, Italy
Marian Vladescu, University Politechnica Bucharest, Romania
Design Tools and Modeling Subcommittee
Chair: Chris Bailey, Arizona State University, UK
Co-Chair: Balasz Illes, Budapest University of Technology and Economics, Hungary
Members:
Laurent Bechou, ims Bordeaux, France
Boris Evstatie, University of Ruse Angel Kanchev, Bulgaria
Bernard Flechet, IMEP, France
Catalin Negrea, Continental Automotive, Romania
Michiel van Soestbergen, NXP, The Netherlands
Ovidiu A. Pop, TU Cluj-Napoca, Romania
Anna Stoynova, Technical University of Sofia, Bulgaria
Stoyan Stoyanov, University of Greenwich, UK
Power Electronics System Packaging Subcommittee
Chair: Thomas Harder, ECPE European Center for Power Electronics, Germany
Co-Chair: Jürgen Schuderer, ABB, Switzerland
Members:
Cyril Buttay, Université de Lyon, Laboratoire Ampère, France
Alberto Castellazzi, Kyoto University of Advanced Science, Japan
Kay Essig, ASE Group, Germany
Andreas Fischer, Bosch, Germany
Aurelian Kotlar, Eberspächer Cluj-Napoca, Romania
Dan Lascu, University Politehnica of Timisoara, Romania
Dorin Petreus, TU Cluj-Napoca, Romania
Jelena Popovic-Gerber, University of Twente, The Netherlands
Christian Schellenberg, Siemens, Germany
Tina Thomas, Fraunhofer IZM, Germany
Advanced Technologies for Emerging Systems Subcommittee
Chair: Martin Schneider-Ramelow, Fraunhofer IZM, Germany
Co-Chair: Martin Oppermann, TU Dresden, Germany
Members:
Attila Bonyár, Budapest University of Technology and Economics, Hungary
Perceval Coudrain, CEA LETI, France
Ferenc Ender, Budapest University of Technology and Economics, Hungary
Aurelian Gontean, University Politehnica of Timisoara, Romania
Alexander Klemm, Bosch, Germany
Changqing Liu, Loughborough University, UK
Toni Mattila, Business Finland, Finland
Cosmin Moisa, Continental Automotive Timisoara, Romania
Klaus-Jürgen Wolter, TU Dresden, Germany
Thomas Zerna, TU Dresden, Germany
Reliability of Electronic Devices and Systems Subcommittee
Chair: Matthias Petzold, Fraunhofer IWM, Germany
Co-Chair: Kirsten Weide-Zaage, Leibniz University Hannover, Germany
Members:
Florin Berinde, Vitesco Technology Timisoara, Romania
Derek Braden, Aptiv, UK
Joke de Messemaeker, imec, Belgium
Hélène Frémont, IMS Bordeaux, France
Laura Frisk, Trelic Ltd., Finland
Dave Harvey, Liverpool John Moores University, UK
Matthias Heimann, Siemens, Germany
Zhiheng Huang, Sun Yat-sen University, China (PRC)
Bálint Medgyes, Budapest University of Technology and Economics, Hungary
Karsten Meier, TU Dresden, Germany
Marta Rencz, Budapest University of Technology and Economics, Hungary
Romuald Roucou, NXP, The Netherlands
Vesa Vuorinen, Aalto University, Finland
Olaf Wittler, Fraunhofer IZM, Germany
Flexible, Printed and Hybrid Electronics Subcommittee
Chair: Matti Mäntysalo, Tampere University, Finland
Co-Chair: Nenad Marjanovic, CSEM, Switzerland
Members:
Nicolas Bernardin, iSorg, France
David Bird, National Centre for Printable Electronics, UK
Karlheinz Bock, TU Dresden, Germany
Detlef Bonfert, Fraunhofer EMFT Munich, Germany
Zheng Cui, Chinese Academy of Sciences, China
Claudia Delgado, Eurecat, Spain
Jukka Hast, VTT, Finland
Ciprian Ionescu, University Politechnica Bucharest, Romania
Jean Charles Souriau, CEA LETI, France
Ashok Sridhar, TNO, Netherlands
Johanna Virkki, Tampere University, Finland
Global Education for Electronics Subcommittee
Chair: Oliver Krammer, Budapest University of Technology and Economics, Hungary
Co-Chair: Diana Andone, University Politehnica of Timisoara, Romania
Members:
Dorel Aiordachioaie, Dunărea de Jos University of Galaţi, Romania
Monica Ciolacu, University of Passau, Germany
Danilo Demarchi, Politecnico di Torino, Italy
Karel Dušek, Czech Technical University Prague, Czeck Republic
Zsolt Illyefalvi-Vitez, Budapest University of Technology and Economics, Hungary
Maria Marcovici, Continental Automotive, Romania
RF, mm-wave and THz Systems Packaging Subcommittee
Chair: Mehmet Kaynak, IHP
Co-Chair: Maurizio Cirillo, Rheinmetall, Italy
Members:
Didier Floriot, UMS, France
Ulf Johannsen, Eindhoven University of Technology, The Netherlands
Dietmar Kissinger, University Ulm, Germany
Julia-Marie Köszegi, Technical University Berlin, Germany
Ken Kuang, Torrey Hills Technologies, LLC, USA
Michael Pretl, Rhode & Schwarz, Germany
Kamal K. Samanta, Sony Europe BV, UK