• 2006, Dresden, Fireworks artist during welcome reception
  • 2006, Dresden, Keynote presentation
  • 2010, Greenwich, University Campus
  • 2016, Grenoble, Networking during break
  • 2014, Helsinki, Audience
  • 2016, Grenoble, Audience
  • 2016, Grenoble, Poster Presentation
  • 2008, Greenwich, Exhibition
  • 2008, Greenwich, Conference attendees
  • 2010, Berlin, Keynote
  • 2010, Berlin, Networking
  • 2014, Helsinki, Finlandia Hall

ESTC 2018 Exhibitors


AMIC GmbH

AMIC - Services in research and development. AMIC covers a wide field of services in testing, simulation prototyping and much more.

Amkor Technology

Amkor stands for high-quality semiconductor packaging and test services. Amkor helps to define and advance the technology manufacturing landscape.

ASE Group

ASE offers services such as semiconductor assembly, packaging and testing. ASE provides semiconductor assembly and testing services for over 90 percent of electronics companies in the world.

budatec GmbH

Budatec GmbH produces equipment for the semiconductor and photovoltaic industries and is located in Berlin. The main business areas are thermal systems and electronic manufacturing products.

CeTaQ GmbH

Independent Capability Analysis Experts - CeTaQ GmbH is a sought-after supplier of surface mounting capability studies (SMT). They are focused on analyzing and optimizing the quality capability of customers production processes.

Chemnitzer Werkstoffmechanik GmbH

CWM offers optical deformation measurement with image correlation, X-ray-CT investigation for geometry and failure analysis, vibration analysis for component and stuctural optimizationand much more.

Cicor Group

Cicor Group offers complete outsourcing services and a broad range of innovative technologies, electronic manufacturing services and a wide range of production options from PCB assembly, system assembly, box-building, toolmaking and plastic injection molding.

DYCONEX

DYCONEX is a leader in highly complex flexible, rigid-flex and rigid HDI/microvia circuit boards and chip-substrate solutions.

First Sensor

In the growth market of sensor systems, First Sensor develops and produces customer-specific sensors, electronics, modules and complex systems for the ever-increasing number of applications in the industrial, medical, and mobility target markets. As a solution provider the company offers complete development services from a first draft and proof of concept up to the development of prototypes and finally serial production. First Sensor offers comprehensive development expertise, state-of-the-art packaging technologies and production capacities in clean rooms from ISO class 8 to 5.

Fraunhofer ENAS

Fraunhofer ENAS - Your System and Technology Partner in the Field of Smart Systems Integration by using Micro and Nano Technologies. The particular strength of the Fraunhofer Institute for Electronic Nano Systems ENAS lies in the development of smart integrated systems for different applications.

Fraunhofer FEP

The Fraunhofer FEP works on innovative solutions in the fields of vacuum coating, surface treatment and organic electronics.

Fraunhofer IZM

Fraunhofer IZM specializes in industry-oriented applied research. With four technology clusters, Fraunhofer IZM covers the entire spectrum of technologies and services necessary for developing reliable electronics and integrating new technology into applications.

FRT GmbH

FRT manufactures powerful surface metrology tools for various sectors such as development, production and quality control.

Fujikura Ltd.

Fujikura Ltd. has developed Chip-stack WABE PackageTM that has several IC chips embedded vertically in a circuit board and put it into use for the first time in the world. Chip-stack WABE PackageTM is the world's first technology to respond to requests from various industries including those of medical/healthcare, automotive and wearable devices that urgently require small and thin electronic circuit boards. We will offer the most suitable solution to our customers of these industries.

GE Sensing & Inspection Technologies GmbH

From the most advanced data collection technology to innovative software enabling remote collaboration, GE provides a full suite of non-destructive testing (NDT) solutions and equipment including radiography, computed tomography and more.

Häcker Automation

Häcker Automation stands for future-oriented solutions in microsystems technology. Häcker Automation operates worldwide in the fields of micro assembly, micro and nano dispensing as well as in micro laser soldering.

IEEE-EPS

The IEEE Electronics Packaging Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacturing.

Lintec Advanced Technologies (Europe) GmbH

LINTEC - A leading company in the fields of adhesive products and fully range of equipments.
LINTEC specializes in proprietary semiconductor manufacturing related products, called Adwill.

Nanotec International

nanotec international provides solutions for semiconductor backend, assembly/packaging and related fields to the European market since more than 15 years. Together with our strong partners, we can supply equipment and materials for processes as Wafer Bonding, Flip Chip, Ball Placing, Reflow, Transfer Molding, Sawing&Placement, Trim&Form, Laser Marking, Laser Cutting, LED Sorting, Pick&Place Sorting, Void-Free Curing/Soldering, Burn-In and many more.

Nanotest GmbH

Berliner Nanotest & Design GmbH is a leading service and equipment supplier for thermal material characterization, system and component analysis and reliability investigations.

Nordson DAGE

Nordson DAGE manufactures and supports a range of Industry Standard, award winning Bondtesters and X-ray inspection systems for the PCBA and Semiconductor industries. Nordson DAGE continues to invest significantly in R&D to remain at the cutting edge of technology.

Optim Wafer Services

OPTIM Wafer Services is a leading provider in wafer processing services like backgrinding or wafer thinning, SOI preparation etc.

Pac Tech GmbH

PacTech (Packaging Technologies GmbH) is a leading supplier of Advanced Packaging Equipment with more than twenty years of engineering experience. PacTech is also a worldwide leader in Wafer Level Bumping & Packaging Services.

Pfarr Stanztechnik

Pfarr Stanztechnik focuses on the production of precision stamped parts used as sub-components in the electronic and microelectronic industries manufacturing discrete electronic devices and modules.

Sentec E&E Co., Ltd.

Sentec Electro Ceramic & Device Group offers various substrate and IC packaging solutions.
Process Technologies were transferred from Panasonic since year 1999.

SGS Institut Fresenius

SGS is the world’s leading inspection, verification, testing and certification company. SGS is recognised as the global benchmark for quality and integrity.

SHT Smart High Tech AB

SHT provides nano-based materials and solutions for thermal management applications using advanced propretiary technologies.

STATS ChipPAC

The JCET Group is a leading outsourcing provider of semiconductor design, wafer bump, packaging and test solutions.

TechSearch International

TechSearch International is recognized around the world as a leading consulting company in the field of advanced semiconductor packaging technology.

Tresky GmbH

Tresky provides custom bonding solutions to a variety of industries.

XYZTEC bv

XYZTEC designs and manufactures innovative equipment that is used for quality assurance to ensure the reliability of many products in multiple industries.