Abstract:

As power densities continue to rise in automotive, aerospace, railway, and industrial electronics, thermal management is becoming a key enabler of future heterogeneous integration. This workshop brings together experts from industry, SMEs, and academia to discuss the current state of the art, emerging technologies, and future challenges from a European perspective. Particular attention will be given to harsh-environment applications, advanced thermal characterization, novel materials such as diamond, and the role of thermal management in chiplet-based and power electronics systems. The panel will explore technology roadmaps for the next 5–15 years and identify the most promising solutions needed to enable reliable, high-performance electronic systems of the future.

Ganesh Chandramouli – Alstom Group

Shaw Fong Wong – Intel Corp.

Mohamad Abo Ras – Berliner Nanotest und Design GmbH, Germany
Thermal Test Vehicles: A Powerful Tool for Characterization and Validation of High-Performance and Chiplet-Based Packages

Bio: Dr. Mohamad Abo Ras is the CEO of Berliner Nanotest und Design GmbH in Berlin, Germany. He has more than two decades of experience in thermal management, electronics packaging, and applied research. His work focuses on thermal characterization, reliability assessment, and the development of thermal test chips and test vehicles for high-performance, chiplet-based, and power electronics packages. He holds a Ph.D. in Materials Science from TU Chemnitz and has authored or co-authored more than 100 publications. He is actively involved in several international thermal management and electronics packaging conferences, including IMAPS, THERMINIC, and SEMI-THERM, and currently serves as Program Chair for the 43rd SEMI-THERM Symposium in 2027.

Wilson Maia – Thales, France
Heterogeneous Integration using COTS chiplets

Bio: Dr. Wilson Maia received his B.S. in Electrical Engineering from the University Federal of Paraná (Brazil) in 2001. He earned a M.S. in Quality and Reliability of Component and Systems and a Ph.D. in Solder Joint Reliability from the University of Bordeaux (France) in 2003 and 2008, respectively. He joined Thales Group in 2004 to pursue his Ph.D. and held positions across Corporate Engineering, Industry, and R&D teams. Dr. Maia has co-authored more than 20 publications in electronics reliability, composite PCB technology, and additive manufacturing. He also contributed to multiple French and European projects. In recent years, he has led a Thales initiative for lead-free alloy deployment and the qualification of special processes using Technological and Manufacturing Readiness (TMR) levels. His current work focuses on heterogeneous integration, including innovative approaches in advanced packaging, and reliability engineering.

Joana Catarina Mendes – Instituto de Telecomunicações, University of Aveiro, Portugal
Diamond Heat Spreaders: Transforming Thermal Management in Automotive and Power Systems

Bio: Joana Catarina Mendes has extensive experience in advanced electronic packaging and thermal management as a researcher at the Institute of Telecommunications, Aveiro, Portugal. Her work focuses on the integration of synthetic diamond into semiconductor devices and packages, addressing heat dissipation challenges in high power density AI, HPC, and RF systems. She has led and contributed to multiple international R&D projects and has authored over 60 peer reviewed publications. Joana has developed and studied diamond based solutions for heterogeneous integration, including heat spreaders and interfaces for high performance electronics. She is actively involved in the international community, serving on the Steering Committee of the Workshop on Compound Semiconductor Devices and Integrated Circuits held in Europe (WOCSDICE), and as a member of the IEEE ECTC/AMT sub-committee. She also chaired the 2023 and 2024 editions of the IEEE Signal and Power Integrity Workshop.

• Er Thorsten Meyer – Infineon, Germany
• Tuomas Lahtinen –  SiPFAB
• Erik Jung, Fraunhofer – Fraunhofer IZM, Germany
• Patricia McLeod, ASE, USA