ESTC 2024

SEPTEMBER 11–13, 2024 BERLIN, GERMANY

TAKE ON A REAL ENGINEERING CHALLENGE

Predictive Modeling and Design Optimization for Advanced Electronic Packaging

Student Competition Challenge

Dear Students,
We are excited to announce a new student competition for the upcoming 11th ESTC conference that will be held between September 09 – 11, 2026 in Helsinki, Finland. This is a great chance for you to showcase your skills, present your innovative ideas, and compete with other students from all around the world. Eligible participants can be undergraduate (BSc) and master’s (MSc) students from any university and should be enrolled in an academic program during the 2025-2026 academic year. Up to 10 finalists will be invited to participate in the upcoming 11th ESTC conference in Helsinki, Finland.

Curious? Find the details in the Technical Subject Overview.

Application Deadline May 15, 2026

Call for Participation

COMPETITION FOCUS

THERMO-MECHANICAL RELIABILITY

Identify stress hotspots, predict deformation and propose robust design improvement.

DESIGN VARIABILITY & LIFETIME PREDICTION

Analyze design variations and assess reliability risks under mission profiles.

BENEFITS

Participants:

Discover exciting career paths in microelectronics and photonics packaging
Gain insight into state-of-the-art packaging technologies and emerging industry trends

Finalists:

Gain visibility with industry professionals and technical leaders attending the conference
Attend the conference with travel and participation costs covered, subject to the available
competition budget and organizer policy
Showcase creative thinking, engineering judgment, and technical problem-solving through
a realistic reliability case study
Build professional networks with potential employers and explore internship and career
opportunities at global technology companies

Documentation and CAD model

Please the full set of launch materials listed below:

the Competition Poster: IEEE ESTC 2026 Student Competition – Poster.pdf

the Call for Participation: IEEE ESTC 2026 Student Competition – Call for Participation.pdf

– The Call for Participation serves as the main reference document and includes links to all supporting competition materials.

the Subject Overview: ESTC 2026 Student Competition – Technical Subject Overview.pdf

the CAD Model: 20260401_ESTC_model_solder.stp

the Report Template: 76th_ectc_student_competition_template.docx

the Registration Form: ESTC 2026 Student Competition Registration

Students can register as individual participants or as part of a team.