Technical Program Committee

The Technical Program Committee plays an important role in ensuring the quality of ESTC. Reviewing the submitted abstracts and papers and finally compiling an interesting and high-class technical program is only possible based on expert driven subcommittees.

The Technical Program Chair, coordinating the work of the subcommittees, changes from one ESTC to the next, while most of the subcommittee members already support ESTC for a long time. There is one subcommittee for each of the conference topics and one additional subcommittee responsible for the poster presentations.

Technical Program Chair for ESTC 2026

Grace O’Malley, INEMI, USA

Advanced Packaging Subcommittee

Chair: Rolf Aschenbrenner, Fraunhofer IZM, Germany

Co-Chair: Klaus Pressel, Infineon Technologies AG, Germany

Materials for Interconnects and Packaging Subcommittee

Chair: Glenn Ross, Aalto University, Finland

Co-Chair: Liqiang Jiantong, KTH Royal Institute of Technology, Sweden

Assembly and Manufacturing Technologies Subcommittee

Chair: Erik Jung, Fraunhofer IZM, Germany

Co-Chair: Hoang-Vu Nguyen, University of South-Eastern Norway, Norway

Optoelectronic Systems Packaging Subcommittee

Chair: Giovanni Delrosso, VTT, Finland

Co-Chair: Henning Schröder, Fraunhofer IZM, Germany

Design Tools and Modeling Subcommittee

Chair: Przemyslaw Gromala, Robert Bosch GmbH

Co-Chair: Chris Bailey, Arizona State University, UK

Power Electronics System Packaging Subcommittee

Chair: Jürgen Schuderer, Hitachi Energy, Switzerland

Co-Chair: Gudrun Feix, ECPE European Center for Power Electronics, Germany

Advanced Technologies for Emerging Systems Subcommittee

Chair: Martin Schneider-Ramelow, Fraunhofer IZM, Germany

Co-Chair: Martin Oppermann, TU Dresden, Germany

Reliability of Electronic Devices and Systems Subcommittee

Chair: Matthias Petzold, Fraunhofer IWM, Germany

Co-Chair: Kirsten Weide-Zaage, Leibniz University Hannover, Germany

Flexible, Printed and Hybrid Electronics Subcommittee

Chair: Jean Charles Souriau, CEA LETI, France

Co-Chair: Jukka Hast, VTT, Finland

RF, mm-wave and THz Systems Packaging Subcommittee

Chair: Mehmet Kaynak, IHP, Germany

Co-Chair: Maurizio Cirillo, Rheinmetall, Italy

The 11th IEEE ESTC