• 2006, Dresden, Fireworks artist during welcome reception
  • 2006, Dresden, Keynote presentation
  • 2008, Greenwich, University Campus
  • 2016, Grenoble, Networking during break
  • 2014, Helsinki, Audience
  • 2016, Grenoble, Audience
  • 2016, Grenoble, Poster Presentation
  • 2008, Greenwich, Exhibition
  • 2008, Greenwich, Conference attendees
  • 2010, Berlin, Keynote
  • 2010, Berlin, Networking
  • 2014, Helsinki, Finlandia Hall
  • 2018, Dresden, PDC
  • 2018, Dresden, Conference dinner
  • 2020, Vestfold, Virtual HIR workshop panelists
  • 2020, Vestfold, Virtual conference chairing

New Registration - Part 1

This is the first part of your ESTC 2022 registration. Please fill in all the data below. After that, proceed to part 2, where you can double-check all data again before you will be forwarded to the online payment procedure, depending on the registration type and options you've chosen.

Personal Data
none / Mrs. / Mr.
Last name
First name
Email address
Institution / Company
Postal address
 I agree, that my above personal data will be stored by ESTC organizers and be used to keep me informed about next ESTC conference in 2024.
Registration Data
Registration type
Additional Items
PDC A - Why is now the right time to start digitalizing electronics manufacturing with an end-to-end holistic solution?
Current fee: 600 EURO
PDC B - Advances in Fan-Out Wafer Level Packaging (FOWLP)
Current fee: 350 EURO
PDC C - Fan-out Packaging and Chiplet Heterogeneous Integration
Current fee: 350 EURO
PDC D - Additive Printed Flexible Hybrid Electronics
Current fee: 350 EURO