• 2006, Dresden, Fireworks artist during welcome reception
  • 2006, Dresden, Keynote presentation
  • 2008, Greenwich, University Campus
  • 2016, Grenoble, Networking during break
  • 2014, Helsinki, Audience
  • 2016, Grenoble, Audience
  • 2016, Grenoble, Poster Presentation
  • 2008, Greenwich, Exhibition
  • 2008, Greenwich, Conference attendees
  • 2010, Berlin, Keynote
  • 2010, Berlin, Networking
  • 2014, Helsinki, Finlandia Hall
  • 2018, Dresden, PDC
  • 2018, Dresden, Conference dinner
  • 2020, Vestfold, Virtual HIR workshop panelists
  • 2020, Vestfold, Virtual conference chairing

New Registration - Part 1


This is the first part of your ESTC 2022 registration. Please fill in all the data below. After that, proceed to part 2, where you can double-check all data again before you will be forwarded to the online payment procedure, depending on the registration type and options you've chosen.


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 I agree, that my above personal data will be stored by ESTC organizers and be used to keep me informed about next ESTC conference in 2024.
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Additional Items
PDCs
PDC A - Why is now the right time to start digitalizing electronics manufacturing with an end-to-end holistic solution?
Current fee: 600 EURO
PDC B - Advances in Fan-Out Wafer Level Packaging (FOWLP)
Current fee: 350 EURO
PDC C - Fan-out Packaging and Chiplet Heterogeneous Integration
Current fee: 350 EURO
PDC D - Additive Printed Flexible Hybrid Electronics
Current fee: 350 EURO