Andreas Fuhrer, IBM Research Europe - Zurich, Switzerland
Utilizing the virtues of entanglement and superposition, quantum computing promises to efficiently solve a range of problems that are considered to be classically intractable i.e. where hardware resources or execution times scale exponentially with problem size. The ultimate goal is to build an error corrected universal quantum computer that can run arbitrary algorithms similar to classical computing systems. However, current error rates of quantum gate operations are at the percent level and limit the number of sequential gates to < 100 and the number of qubits to a few tens. The presentation will discuss currently available quantum computing hardware at IBM and introduce QiskitTMas a tool to program real quantum processors. Moreover, limitations of current hardware will be explained and an industry perspective on useful future quantum applications with near-term quantum devices will be given.
Andreas likes it cool: having worked most of his scientific life with measurements in dilution refrigerators Andreas is a Research Staff Member in the Quantum Technology group at IBM Research Europe - Zurich since 2008. He holds a PhD in Physics from ETH Zurich and his research interests lie in quantum computing with silicon spin qubits and superconducting transmon qubits, in semiconductor spintronics and in SPM based device fabrication techniques. In the last few years he helped set-up the quantum lab at IBM Research Europe - Zurich and led a team that investigated the impact of ultra-high-vacuum packaging on the performance of quantum circuits at millikelvin temperatures.
Alan O'Riordan, Tyndall National Institute, Cork, Ireland
With the global population expected to grow to over 9.6 billion by 2050 it is a projected that a 50-60 % increase in food production will be required. A key challenge then, going forward, will be to sustainably close the food gap. This must be achieved against the backdrop of climate change & desertification, labour shortages and competition for energy, land & resources. It is clear then, that addressing this challenge will require the development of more efficient and sustainable food production techniques and processes. To this end, new technologies, that are fit for purpose, are urgently required to digitise the entire food chain. This convergence between the Internet of Things (IoT) and the agri-food industry requires sensor systems and technologies that provide real time data to producers and processers; required for rapid, but informed, decision making. This presentation will provide an overview on current problems in agriculture and demonstrate how digital technologies can address the sustainability issues currently being experienced in this sector.
Dr Alan O’Riordan (Sensor-PI) is a Senior Research Fellow at the Tyndall National Institute. He received his BSc in Analytical Chemistry in 1995 and a PhD in Chemistry (Nanotechnology) in 2005. The O’Riordan group is focused on developing smart sensor systems for Sustainable Agri-food and Environmental applications. Real-time analytical data is essential to enable stakeholders to make rapid and informed decisions in the field. In many cases, this requires the creation of new and fit for purpose end-to-end sensing solutions. A key challenge to providing such solutions, is the need to develop and fabricate sensors that are sensitive, selective and saleable. The group is active along the entire sensor development chain including: (i) Fundamental Science - theoretical simulations (analyte diffusion, electric fields) to elucidate factors affecting nanosensor performance, (ii) Nanofabrication – design and fabrication of reliable and robust nanostructured sensor devices, (III) Sensor modification - materials composition and surface chemical and biochemical modification and (iv) System integration - combining our advanced nanosensors with bespoke (or commercial) electronics and software.
Tanja Braun, Group Manager Fraunhofer IZM Berlin, Germany
Fan-out Wafer and Panel Level Packaging are latest trends in microelectronics packaging. Besides technical advantages and cost opportunities for manifold applications, FOWLP and PLP have also changed the packaging landscape. High volume manufacturing capabilities are available at OSATs worldwide. But also new players in packaging as semiconductor foundries, PCB or LCD manufacturing companies have recently entered this business. In summary the presentation will highlight recent technical developments as well as the changing ecosystem and actual business scenarios including the move to panel level manufacturing.
Tanja Braun studied mechanical engineering at Technical University of Berlin with a focus on polymers and micro systems and joined Fraunhofer IZM in 1999. Since 2000 she is working with the group Assembly & Encapsulation Technologies and since 2016 she is head of this group. In 2013 she received her Dr. degree from the Technical University of Berlin for the work focusing on humidity diffusion through particle-filled epoxy resins.Her field of research is process development of assembly and encapsulation processes, the qualification of these processes using both non-destructive and destructive tools and advanced polymer analysis. Recent research is focused on wafer and panel level packaging technologies and Tanja Braun is leading the Fan-out Panel Level Packaging Consortium at Fraunhofer IZM Berlin.
Results of her research concerning packaging for advanced packages have been presented at multiple international conferences. Tanja Braun holds also several patents in the field of advanced packaging. In 2014 she received the Fraunhofer IZM research award.
Tanja Braun is an active member of IEEE. She is member of the IEEE EPS Board of Governor (BOG) and Technical Chapter “Materials & Processing” as well as the IEEE EPS Women in Engineering (WIE) delegate. Currently she is also ECTC subcommittee chair of “Materials & Processing”.
Michael Pecht, IEEE EPS Distinguished Lecturer, USA
The Internet of Things is not only permitting the sensing and control of numerous products and systems but enabling the collection of otherwise unattainable data. With the use of artificial intelligence methods, we can now use this data to assess the “health” (e.g. deviation or degradation) of a system from an expected normal operating condition, diagnose faults, to predict the future state of the system and forecast logistics actions, including maintenance and alternative mission profiles. This presentation discusses the artificial intelligence methods, gives examples on what companies have already implemented, and presents possibilities for the future.
Prof Michael Pecht (30,000+ citations, 80+ H-Index) has a BS in Physics, an MS in Electrical Engineering and an MS and PhD in Engineering Mechanics from the University of Wisconsin. He is a Professional Engineer, an IEEE Fellow, a PHM Society Life Fellow, an ASME Fellow, an ASM Fellow, an SAE Fellow and an IMAPS Fellow. He served as editor-in-chief of IEEE Access for six years, as editor-in-chief of IEEE Transactions on Reliability for nine years, editor-in-chief of Microelectronics Reliability for sixteen years, and editor of Circuit World. He has also served on three U.S. National Academy of Science studies, two US Congressional investigations in automotive safety, and as an expert to the U.S. FDA. He is the Director of CALCE (Center for Advanced Life Cycle Engineering) at the University of Maryland (UMd), which is funded by over 150 of the world’s leading electronics companies at more than US$6M/year. He is also a Professor in Applied Mathematics at UMd. In 2008, he was awarded the highest reliability honor, the IEEE Reliability Society’s Lifetime Achievement Award. In 2010, he received the IEEE Exceptional Technical Achievement Award for his innovations in the area of prognostics and systems health management.
Lars Kristian Moen, Kongsberg Maritime, Norway
The need for improved efficiency and safety together with initiatives for cost reduction has made the international shipping and offshore vessels become more and more automated. Today the industry face new requirements from authorities to lower emissions further. This challenge the maritime industry for new solutions with combined environmental, safety and cost reduction effects.
Kongsberg Maritime (KM) has developed Autonomous Underwater Vehicles since the early 80's (“HUGIN”). Remotely Controlled Dynamic Positioning vessels was implemented with Sea Launch already in the 90's. KM uses state-of-the-art sensor technology, computer and communication technology for improving safety and regularity and reducing operational and maintenance cost.
When introducing technology to partly replace the "human in the loop", algorithms need to be tested and proven robust. Advanced and realistic simulators are required to test various environmental conditions, traffic conditions and operational scenarios.
This keynote will address some of the technical achievements related to maritime autonomy as well as how Kongsberg Maritime has worked with stakeholders to secure that such solutions are approved for commercial operation. The keynote will elaborate on what type of marine operations that seems to be ready for such technology first and why.
Lars Kristian Moen graduated as MSc in Cybernetics from the Norwegian Institute of Technology (today NTNU), in 1985. He has held a variety of positions in Kongsberg Maritime/ the Kongsberg group since 1986, including product development and Product Manager for Dynamic Positioning. He has served as President for Kongsberg Simrad Inc, Houston, Texas. His current position is as Sales Director, Autonomy and Advanced Maneuvering, Kongsberg Maritime.