• 2006, Dresden, Fireworks artist during welcome reception
  • 2006, Dresden, Keynote presentation
  • 2008, Greenwich, University Campus
  • 2016, Grenoble, Networking during break
  • 2014, Helsinki, Audience
  • 2016, Grenoble, Audience
  • 2016, Grenoble, Poster Presentation
  • 2008, Greenwich, Exhibition
  • 2008, Greenwich, Conference attendees
  • 2010, Berlin, Keynote
  • 2010, Berlin, Networking
  • 2014, Helsinki, Finlandia Hall
  • 2018, Dresden, PDC
  • 2018, Dresden, Conference dinner
  • 2020, Vestfold, Virtual HIR workshop panelists
  • 2020, Vestfold, Virtual conference chairing

Special Workshops

ESTC 2022 schedules some Special Workshops.

Hot topics in the field of electronic packaging are presented and discussed. Share your experiences and opinions with colleagues.

Workshop 1 - Climate neutrality and sustainable electronics

Nils F. Nissen, Fraunhofer Institute for Reliability and Microintegration (IZM) Berlin, Germany

Although the other environmental hot spots of electronics – such as phasing out critical substances and minimizing harm from electronic waste – are not solved, the global focus is currently on climate neutrality and the accounting of greenhouse gas emissions.

This workshop will explain carbon accounting through the lens of electronic products and of the development of electronic technologies. Many electronics companies are either pushing for ambitious carbon reduction goals themselves, or are confronted with carbon disclosure requests from their business partners in the supply chain. The workshop will include time to share experiences from participants across the supply chain and from research and development.

For many products of the electronics industry, the carbon footprint is dominated by the energy consumption in the use phase. But for products with optimized energy efficiency, or with extreme density of ICs and in particular for mobile products the main environmental burden is caused by the manufacturing. In these cases, the accounting of carbon emissions throughout the whole supply chain is key to understanding, measuring and minimizing the upstream emissions, which are not directly caused by the company’s own operations. A major focus of political activity and hence of standardization and implementation is therefore on pragmatic delivery of carbon emission data through the supply chain. The workshop will also provide context of other environmental and sustainability issues not directly related to carbon emissions.

Dr. Nils F. Nissen is head of the department Environmental and Reliability Engineering at the Fraunhofer Institute for Reliability and Microintegration (IZM) in Berlin, Germany. The Environmental and Reliability Engineering department of this microelectronics institute is supporting technology development by integrating environmental and reliability aspects right from the start. This means dealing with all environmental facets of new electronic technologies, from eliminating toxic substances to improving the recycling of products, from screening the latest process technologies in electronics to the ecodesign and environmental assessment of products and systems. CO2 footprinting and climate neutrality are the most prevalent topics in this area currently. In total, Dr. Nissen has been working 27 years at the juncture of electronics technology and environmental issues, and he is the Technical Chair of the Electronics Goes Green conference series.

Workshop 2 - iRel40 – Intelligent Reliability along the Value Chain

organized by Klaus Pressel and Josef Moser, iRel40 project leadership team

The major trend in Microelectronics is the move towards higher system integration driving increasing compactness and complexity. All this must be at acceptable cost and required quality and reliability. The ECSELJU project iRel40 has the ultimate goal of improving reliability of electronic components and systems by reducing failure rates along the entire value chain. In iRel40 75 partners from 13 countries are collaborating along the value chain from wafer production to system integration and combine their strength to enhance reliability in Europe. In this iRel40 session we present first results on four iRel40 related topics: The first presentation is on innovative testing, the second is on intelligent manufacturing, the third is on development towards virtual prototyping, and the fourth is on artificial intelligence applied to image detection. Target of all four topics is on research and development applying Artificial Intelligence, Digital Twins and Machine Learning concepts for reliability improvement.

Following presentations will be given:

Holistic Testing in iRel40 and Impact on Reliability
Susan Zhao (Signify, The Netherlands)

Intelligent Manufacturing – From the  Chip – Package – Board/System:  Impact on reliability
Klaus Pressel, Josef Moser et al. (Infineon Technologies, Germany)

Virtual Design for Life Time optimization of M2X Modules – A Use Case from the IRel40 project
Thomas Krivec et al.  (AT&S, Austria)

AI applied to CSAM Images
Jason Zi Jie Chia (Elmos Semiconductor), together with N.N. (Okmetic, Finland)

Workshop 3 - Nanopackaging / Nanotechnology

The Gold-Tin Intermetallic Compounds Evolution After The Rolling Process

Traian Cucu, Ametek Coining (USA)

The Gold-Tin alloys are the most commonly used alloys for high temperature soldering, with the 80%Au-20%Sn by weight, being the preferred flavor, due the eutectic nature of the mixture. The melting point of the 80%Au-20%Sn is around 280°C making it ideal for the flip-chip assembly process, that has a 270°C-350°C peak temperatures requirement. Furthermore, its capability to be reflowed without flux guarantees the application in high power applications, photonics integration and hermetic encapsulation (full hermetic, especially vacuum enclosures). Its high corrosion resistance makes it an ideal candidate for medical devices applications and sensors for high corrosive environments. The Gold-Tin intermetallic species play an important role in the bulk performance of the joint, after the soldering process and the ratio of different species, in the bulk material, both before and after the reflow process, will have a direct influence on material performance. This paper looks at the evolution of different intermetallic species throughout the manufacturing process and considers the optimal ratios in the final Gold-Tin part, before the reflow process, in order to achieve a reliable joint making use of a wide (most flexible) process window.

Traian Cucu is presently leading the Engineering Department at Ametec Coining. He oversees all R&D and engineering activities, providing technical solutions and new materials to support the full solution offering for the packaging and assembly markets. He received his B.Sc degree from “Politehnica” University of Timisoara, , Faculty of Electrical and Power Engineering, Specialization: Industrial Power Systems and his Ph.D. from Politechnic University of Bucharest, Faculty of Electronics, Telecommunications and Information Technologies, Specialization: Electronic Technology. He was working with major OEMs on transition to finer pitch designs and 3D assembly systems for the next generation devices. From 2013, as Global Product Manager for Solder Paste, was in charge of the solder paste product development, overseeing the product development programs and directing Alpha’s global solder paste strategy, during a period of 4 years. During that period, he was directly involved in new solder paste chemistry platforms developments and new alloy developments. From 2017, as Global Applications and Technologies Experts Group Leader at MacDermid Alpha Electronics Solutions, he was overseeing the new applications and technologies development programs for the assembly market. Since 2021 he is leading the Engineering Department at Ametec Coining where he is involved with new alloy development programs for soldering and brazing alloys and engineered materials programs for advanced electronic packaging.


Metrology Solutions For Nanoscale Leading-Edge Technology Nodes

Marius Enachescu, Center for Surface Science and Nanotechnology University Politechnica of Bucharest (Romania)

The importance and necessity of semiconductor devices in our lives is indisputable. Researchers and engineers are devoting continuous efforts to develop key technologies for the new ICs generations with increasingly smaller electronic nodes following the Moore's Law. Current developments are targeting 3nm and 2nm nodes. One of the crucial pillars that allow such technological advances is the metrology. It is mandatory to optimize/develop the metrological tools and enable them to meet the requirements imposed by the new electronic nodes. CSSNT-UPB offers state-of-the-art metrological solutions/services in support of industrial developments, carried out within the most challenging nanoelectronics projects (e.g. R3POWER-UP, REACTION, OCEAN12, MADEiN4, PiN3S, IT2, BEYOND5).

Professor Dr.rer.nat. Marius Enachescu with international recognition, being among the world pioneers in designing and building STM-AFM systems as basic instruments for investigations at atomic and nanoscale (at Technical University of Munich, Germany, 1990-1995). After a long period of research in world leading laboratories in the field of nanoscience and nanotechnologies (1997-2009 at Lawrence Berkley laboratory and CEO&CTO-Marena Systems Corporation, Hayward-Silicon Valley, USA) he returned in his country of origin, Romania, bringing with him an invaluable expertise in exploiting quantum effects and nano-scale phenomena in order to design and develop new fundamental concepts and building innovative devices for various applications, including nanoelectronics, nanofabrication, nanotechnologies, nanotribology, nanomechanics and nanooptics fields. He is currently Professor at University POLITEHNICA of Bucharest and Vice-Rector and Director of Council for Doctoral Studies at the University of Pitesti. Professor Enachescu is the author/co-author of 12 International patents: USA-5, Taiwan-2, Europe-4, China-1; 9 books/chapters, all in international publishing houses; over 100 articles published in ISI journals; h-index: 22; over 25 invited lectures to international conferences and universities; author/co-author of ~250 other invited and contributed presentations at various international conferences/congresses. He led over 38 international projects in USA and Europe and has been awarded with gold medals, national and international prizes for his scientific achievements. He is also the founder and Head of the Center for Surface Science and NanoTechnology (CSSNT) at UPB.


Next generation of enabling AM technologies for (sub)-micro resolutions

Goran Mišković, Silicon-Austria (Austria)

In this presentation an overview of the next generation AM technologies  will be presented. Main focus will be placed on Electrohydrodynamic Printing – EHD printing.
EHD (also known as E-jet) is a cutting-edge printing technology which is one of the most promising enabling technology for additive manufacturing of the future. In this talk, SAL’s beyond state-of-the-art EHD prototype printer will be introduced. Basic EHD working mechanism will be explained and the printer’s advanced features and capabilities will be presented. Last but not least, some of the in-house printed structures will be shown.

Dr. Goran Mišković (Senior scientist and Project Manager) IEEE Senior member and nanopackaging  TC member. He received his Ph.D. with honors in 2016 from Vienna University of Technology (TU Wien), where he dealt with metal oxide-based gas sensors , with the accent on detection of NOx gasses. From 2012 till 2016, he worked as a lecturer and project assistant on two FP7 projects as well as on several bilateral and industrial projects at TU Wien, where he dealt sensors and actuators fabricated with multilayer Low Temperature Co-Fired Ceramic (LTCC) technology. After completion of the doctoral studies, he has switched to the industry and joined TDK Electronics, where was working in the corporate R&D - innovative topic group. His main activities and responsibilities were evaluation and assessment of new technologies, concepts and ideas. Since 2020, he has joined Silicon Austria Labs, Austria’s reputable R&D and competence center, and since July 2021 he became certified IPMA Project Manager. He is a member of the Sensor System research division and his main research interests are in field of heterogeneous integration & packaging, sensors & actuators, additive manufacturing, material science and technology, MEMS devices, microsystem technologies, flexible and wearable electronics and hybrid systems.


Nanosinterning... (tbd.)

Michiel de Monchy, Macdermid Alpha Assembly Solutions (The Netherlands)


Workshop 4 - IPCEI - A Session on Industrial Research on Assembly & Packaging in Europe

organized by Klaus Pressel and Josef Moser, Infineon Technologies AG

The first “Important Project of Common European Interest on Microelectronics (IPCEI ME)”, which started in 2017, is a common project supported by the five European countries France, Germany, Italy, U.K. and Austria. The IPCEI project's overall objective is to enable research and development of innovative technologies and advanced electronics components with focus on strengthening development of production capabilities in Europe including First Industrial Deployment (FID). The second IPCEI supporting microelectronics and communication technologies in Europe (IPCEI on ME/CT) is currently under preparation. Focus of this special session at ESTC 2022 will be to present four selected examples from industry research and development in Microelectronics and Microsystems from the first IPCEI ME with special focus on assembly and packaging technologies towards system integration. Representatives of major European microelectronics industry will give an insight into their R&D results achieved to support development of fabrication capabilities in assembly and packaging for innovative products in Europe.

Following presentations will be given:

Introduction to IPCEI ME and IPCEI ME/CT
Klaus Pressel (Infineon Technologies, Germany)

Chip-Package-Board System CoDesign applied to fan-out WLP Technology
Thomas Brandtner (Infineon Technologies, Austria) and Maciej Wojnowski (Infineon Technologies, Germany)

Reliabiliy of SiC Modules for Automotive Applications
Alessandro Sitta and Michele Calabretta (STMicroelectronics, Italy)

Data Transmission Green and Fast
Claudia Ebner (AT&S, Austria)

Workshop 5 -

(detailed information coming soon)

Workshop 6 -

(detailed information coming soon)