• 2006, Dresden, Fireworks artist during welcome reception
  • 2006, Dresden, Keynote presentation
  • 2008, Greenwich, University Campus
  • 2016, Grenoble, Networking during break
  • 2014, Helsinki, Audience
  • 2016, Grenoble, Audience
  • 2016, Grenoble, Poster Presentation
  • 2008, Greenwich, Exhibition
  • 2008, Greenwich, Conference attendees
  • 2010, Berlin, Keynote
  • 2010, Berlin, Networking
  • 2014, Helsinki, Finlandia Hall
  • 2018, Dresden, PDC
  • 2018, Dresden, Conference dinner
  • 2020, Vestfold, Virtual HIR workshop panelists
  • 2020, Vestfold, Virtual conference chairing

Poster Gallery

Schedule of the poster evaluation

Posters will be evaluated during the poster session (Tuesday 19:20..20:30). The evaluation will be done by 12 poster evaluation teams with two members each. Every poster will evaluated by two teams. Please be prepared to present your poster two times in a short (3..4 minutes) oral presentation. A discussion including questions about your poster will follow. The evaluation discussion duration will be ten minutes maximum.


For the latest e-Posters and VideoPitches please go to this link.


P1 - New opto-packaging concepts with electrical feedthrough and optic-micro-assembly by using laser direct soldering


P2 - Self-configurable decade box: Design and measurements


P3 - Electrochemical migration investigation on SAC alloys incorporated by TiO2 nanoparticles in NaCl solution


P4 - Low temperature sapphire to silicon flip chip interconnects by copper nanoparticle sintering


P5 - Practical Considerations for Using Telcordia SR-332 Reliability Standard Prediction Applied to a DC-DC PoL Converter Case


P6 - Thermal behavior of FR4 and Flexible substrates for high output IR LEDs application


P7 - A Tunable High Linearity V-I Converter with FG-MOS Translinear Networks for Low Supply Voltage Applications


P8 - Using the car in motion relative wind power for charging the car batteries


P9 - PSpice Model for a Graphene Hall Sensor


P10 - Implementation of a high voltage power supply for underground cable test


P11 - Implementation of a measurement platform for examining passive components and circuits


P12 - Hygro-thermal Analysis of Embedded Device Package in Reflow Process


P13 - Epoxy based Solder Paste for Flexible Substrate with Laser Assisted Bonding Process


P14 - Novel Cu-nanowire-based technology enabling fine pitch interconnects for 2.5D/3D Integration


P15 - Investigations on the Robustness of a Solderless Assembled Electronic Module


P16 - Intelligent Information Integrated System Applied on Advanced Packages Diagnostic


P17 - Technological Platform for Adjustment and Testing of Hybrid Electronic Voltage Regulators for Cars


P18 - Platform for Research on the Conditions of Use of LiFePO4 Batteries in Oorder to Increase their Service Life


P19 - Additional use cases for RFID tags by implementing 3D printed push-button functionalities


P20 - Impact of Temperature Cycling Conditions on Board Level Vibration for Automotive Applications


P21 - Investigations on experimental data obtained by Electrochemical Impedance Spectroscopy on Supercapacitors Structures


P22 - Wearable triple band WLAN antenna on leather belt


P23 - Neural Estimator of Sound Speed in Air for Ultrasonic Sensing in Manufacturing Environments


P24 - A Novel Dieletric Slot Stripline Structure for Millimeter Wave Flexible Printed Circuit


P25 - Bringing Nanotechnology Closer to Electrical Engineers: Training Course Development for Upskilling in the METIS Project


P26 - Real-time isotropic measurement system based on Software Defined Radio


P27 - Wafer-Level Thin Film Encapsulation for RF MEMS Using SiN/SU-8 Membrane


P28 - Analysis of the Degree of Congestion of WiFi, Bluetooth and ZigBee Communication Media


P29 - Real-Life Functional Tests of Conductive Joints of SMD Components on E-Textiles


P30 - Behaviour of printed resistors compatible with thick film copper technology


P31 - Thermoelectric energy harvesting: printed devices and overview from a design standpoint


P32 - Feasibility Study of Magnetically Enhanced Interconnects for Integration of Flexible and Stretchable Electronics


P33 - Electronic System for the Management of a Beehive


P34 - MLCC Acoustic Noise Mitigation via Appropriate Design