The 10th IEEE ESTC

SEPTEMBER 11–13, 2024 | BERLIN, GERMANY

Technical Program Committee

The Technical Program Committee plays an important role in ensuring the quality of ESTC. Reviewing the submitted abstracts and papers and finally compiling an interesting and high-class technical program is only possible based on expert driven subcommittees.

The Technical Program Chair, coordinating the work of the subcommittees, changes from one ESTC to the next, while most of the subcommittee members already support ESTC for a long time. There is one subcommittee for each of the conference topics and one additional subcommittee responsible for the poster presentations.

Technical Program Chair for ESTC 2024

Toni Mattila, Business Finland, Finland

Advanced Packaging Subcommittee

Chair: Rolf Aschenbrenner, Fraunhofer IZM, Germany

Co-Chair: Klaus Pressel, Infineon Technologies AG, Germany

Members:
Eric Beyne, IMEC, Belgium
Björn Böhme, Global Foundries Dresden, Germany
Beth Keser, Intel Corporation, USA
Steffen Kröhnert, ESPAT Consulting, Germany
Franck Murray, Murata, France
Ranjan Rajoo, Global Foundries, Singapore
Johannes Stahr, AT&S, Austria
Jan Vardaman, TechSearch International, USA
Seungwook (Stewart) Yoon, Samsung, South Korea
Christophe Zinck, ASE Europe, France
Marin Gheorghe, NANOM-MEMS, Romania
Karan Bhangaonkar, Intel Corporation, USA

Materials for Interconnects and Packaging Subcommittee

Chair: Glenn Ross, Aalto University, Finland

Co-Chair: Liqiang Jiantong, KTH Royal Institute of Technology, Sweden

Members:
Samjid Mannan, King’s College, UK
Paul Conway, University of Loughborough, UK
Bradford Factor, ASE Europe, France
Jan Felba, University of Wroclaw, Poland
Hiroshi Nishikawa, Osaka University, Japan
Ali Roshanghias, Silicon Austria Labs GmbH, Austria

Assembly and Manufacturing Technologies Subcommittee

Chair: Erik Jung, Fraunhofer IZM, Germany

Co-Chair: Hoang-Vu Nguyen, University of South-Eastern Norway, Norway

Member:
Knut E. Aasmundtveit, Vestfold Univ. College, Norway
Laurent Herard, STMicroelectronics, France
Gabriel Chindris, Technical University of Cluj Napoca, Romania
David Henry, CEA LETI, France
Attila Géczy, Budapest University of Technology and Economics, Hungary
Vidya Jayaram, Intel Corporation, USA

Optoelectronic Systems Packaging Subcommittee

Chair: Giovanni Delrosso, VTT, Finland

Co-Chair: Henning Schröder, Fraunhofer IZM, Germany

Members:
Stéphane Bernabé, CEA LETI, France
Karlheinz Bock, TU Dresden, Germany
Ulrich Fischer-Hirchert, Hochschule Harz, Univ. of Appl. Sci., Germany
Mark Shaw, ST Microelectronics, Italy
Lars Brusberg, Corning Inc., USA
Richard Pitwon, Resolute Photonics
Krzysztof Nieweglowski, TU Dresden, Germany

Design Tools and Modeling Subcommittee

Chair: Przemyslaw Gromala, Robert Bosch GmbH

Co-Chair: Chris Bailey, Arizona State University, UK

Member:
Sven Rzepka, Fraunhofer ENAS, Germany
Ivana Kovacevic, ETH Zurich, Switzerland
Tamara Bechtold, Jade University, Germany
Mohan Prashanth Javare Gowda, Intel, Germany
Michiel van Soestbergen, NXP, Netherlands
Agata Skwarek, Lukasiewicz, Institute of Microelectronics and Photonics, Poland
Ovidiu A. Pop, TU Cluj-Napoca, Romania
Stoyan Stoyanov, University of Greenwich, UK
Wilson Maia, Thales Group, France
Bart Vandevelde, IMEC, Belgium

Power Electronics System Packaging Subcommittee

Chair: Jürgen Schuderer, Hitachi Energy, Switzerland

Co-Chair: Gudrun Feix, ECPE European Center for Power Electronics, Germany

Members:
Cyril Buttay, Université de Lyon, Laboratoire Ampère, France
Alberto Castellazzi, Kyoto University of Advanced Science, Japan
Kay Essig, ASE Group, Germany
Teng Long, Cambridge University, UK
Aurelian Kotlar, Eberspächer, Romania
Dan Lascu, University Politehnica of Timisoara, Romania
Dorin Petreus, TU Cluj-Napoca, Romania
Tina Thomas, Fraunhofer IZM, Germany

Advanced Technologies for Emerging Systems Subcommittee

Chair: Martin Schneider-Ramelow, Fraunhofer IZM, Germany

Co-Chair: Martin Oppermann, TU Dresden, Germany

Members:
Alexander Klemm, Bosch, Germany
Attila Bonyár, Budapest University of Technology and Economics, Hungary
Changqing Liu, Loughborough University, UK
Klaus-Jürgen Wolter, TU Dresden, Germany
Thomas Zerna, TU Dresden, Germany
Cosmin Moisa, Continental Automotive Timisoara, Romania
Perceval Coudrain, CEA LETI, France

Reliability of Electronic Devices and Systems Subcommittee

Chair: Matthias Petzold, Fraunhofer IWM, Germany

Co-Chair: Kirsten Weide-Zaage, Leibniz University Hannover, Germany

Members:
Hélène Frémont, IMS Bordeaux, France
Dave Harvey, Liverpool John Moores University, UK
Matthias Heimann, Siemens, Germany
Zhiheng Huang, Sun Yat-sen University, China (PRC)
Bálint Medgyes, Budapest University of Technology and Economics, Hungary
Karsten Meier, TU Dresden, Germany
Marta Rencz, Budapest University of Technology and Economics, Hungary
Romuald Roucou, NXP, The Netherlands
Vesa Vuorinen, Aalto University, Finland
Joke de Messemaeker, imec, Belgium
Derek Braden, Aptiv, UK
Olaf Wittler, Fraunhofer IZM, Germany
Florin Berinde, Vitesco Technology Timisoara, Romania

Flexible, Printed and Hybrid Electronics Subcommittee

Chair: Jean Charles Souriau, CEA LETI, France

Co-Chair: Jukka Hast, VTT, Finland

Members:
Matti Mäntysalo, Tampere University, Finland
Karlheinz Bock, TU Dresden, Germany
Detlef Bonfert, Fraunhofer EMFT, Germany
Zheng Cui, Chinese Academy of Sciences, China
Johanna Virkki, Tampere University, Finland
Claudia Delgado, Eurocat, Spain

RF, mm-wave and THz Systems Packaging Subcommittee

Chair: Mehmet Kaynak, IHP, Germany

Co-Chair: Maurizio Cirillo, Rheinmetall, Italy

Members:
Michael Pretl, Rhode & Schwarz, Germany
Matthias Wietstruck, IHP Microelectronics
Ulf Johannsen, Eindhoven University of Technology, The Netherlands
Kamal K. Samanta, Sony Europe BV, UK