• 2006, Dresden, Fireworks artist during welcome reception
  • 2006, Dresden, Keynote presentation
  • 2010, Greenwich, University Campus
  • 2016, Grenoble, Networking during break
  • 2014, Helsinki, Audience
  • 2016, Grenoble, Audience
  • 2016, Grenoble, Poster Presentation
  • 2008, Greenwich, Exhibition
  • 2008, Greenwich, Conference attendees
  • 2010, Berlin, Keynote
  • 2010, Berlin, Networking
  • 2014, Helsinki, Finlandia Hall
  • 2018, Dresden, PDC
  • 2018, Dresden, Conference dinner

ESTC 2020 Sponsors


Gold Sponsor

ASE Group

ASE is the global leader in advanced semiconductor packaging & test, delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, Automotive, High Performance Computing and more. To learn about our advances in SiP, Fanout, MEMS & Sensor, Flip Chip, and, 2.5D, 3D & TSV technologies, please visit our virtual exhibitor room.

Business Finland

Sustainable Manufacturing program supports trade, investments and innovation in fields of electronics and photonics. We help companies and research institutions all over the world to engage with the Finnish electronics and photonics ecosystems.


Silver Sponsor

AEMtec GmbH

Next Level of Technology.

budatec GmbH

Budatec GmbH produces equipment for the semiconductor and photovoltaic industries and is located in Berlin. The main business areas are thermal systems and electronic manufacturing products.


Sponsor for Plenary Sessions & Technical Sessions

Finetech GmbH & Co. KG

Finetech is the leading equipment manufacturer for sub-micron die bonding and advanced SMD rework. We provide highly flexible solutions for each stage of your journey - from R&D and prototyping to industrial automated production.

SINTEF

Technology for a better society

Zymet, Inc.

Zymet manufactures Adhesives & Encapsulants and has been serving the electronics industry for over 30 years. Products include reworkable underfills and edgebond adhesives for high reliability and harsh environment applications, ultra-low stress adhesives, electrically conductive adhesives, thermally conductive adhesives, and non-conductive pastes.


Sponsor for Registration

Zymet, Inc.

Zymet manufactures Adhesives & Encapsulants and has been serving the electronics industry for over 30 years. Products include reworkable underfills and edgebond adhesives for high reliability and harsh environment applications, ultra-low stress adhesives, electrically conductive adhesives, thermally conductive adhesives, and non-conductive pastes.