ASE is the global leader in advanced semiconductor packaging & test, delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, Automotive, High Performance Computing and more. To learn about our advances in SiP, Fanout, MEMS & Sensor, Flip Chip, and, 2.5D, 3D & TSV technologies, please visit our virtual exhibitor room.

Sustainable Manufacturing program supports trade, investments and innovation in fields of electronics and photonics. We help companies and research institutions all over the world to engage with the Finnish electronics and photonics ecosystems.

Next Level of Technology.

Budatec GmbH produces equipment for the semiconductor and photovoltaic industries and is located in Berlin. The main business areas are thermal systems and electronic manufacturing products.

Finetech is the leading equipment manufacturer for sub-micron die bonding and advanced SMD rework. We provide highly flexible solutions for each stage of your journey - from R&D and prototyping to industrial automated production.

Technology for a better society

Zymet manufactures Adhesives & Encapsulants and has been serving the electronics industry for over 30 years. Products include reworkable underfills and edgebond adhesives for high reliability and harsh environment applications, ultra-low stress adhesives, electrically conductive adhesives, thermally conductive adhesives, and non-conductive pastes.