Chaired by William Chen (ASE Group, USA), Rolf Aschenbrenner (Fraunhofer IZM Berlin, Germany) & Bill Bottoms (Third Millenium Test Solutions, USA)
The HIR workshop will be held as a Zoom webinar. You can register in advance here.
Heterogeneous Integration Roadmap (HIR)
Workshop @ ESTC 2020
September 15th 2020
9:00 am – 11:50 am
Live On-Line Workshop
The Heterogeneous Integration Roadmap (HIR), released October 2019, is a roadmap to the future of electronics identifying technology requirements and potential solutions. The primary objective is to stimulate pre-competitive collaboration between industry, academia and government to accelerate progress. The roadmap offers professionals, industry, academia and research institutes a comprehensive, strategic forecast of technology over the next 15 years. The HIR also delivers a 25-year projection for heterogeneous integration of Emerging Research Devices and Emerging Research Materials with longer research-and-development timelines.
This HIR workshop @ESTC will feature selected topics from the HIR chapters including an overview presentation followed by a panel session addressing advancing Heterogeneous Integration in the Covid 19 era. The purposes for the HIR workshop at ESTC are to feature interest & stimulate collaboration for the HIR stakeholders around the world and particularly in Europe.
|9:00 – 9:05||Welcome|
|9:05 – 9:30||HIR Overview|
|9:30 – 10:50||HIR Chapters Highlight Session|
|Session Moderators: Rolf Aschenbrenner & Bill Chen|
|9:30 – 9:40||SiP & Module (Erik Jung)|
|9:40 – 9:50||Integrated Photonics (Bill Bottoms)|
|9:50 – 10:00||Automotive Electronics (Andreas Grassmann)|
|10:00 – 10:10||MEMS & Sensor Integration (Jean-Charles Souriau)|
|10:10 – 10:20||Co-Design & Simulation (Chris Bailey)|
|10:20 – 10:30||5G (Kamal Samanta)|
|10:30 – 10:50||Live Q&A (20 Minutes) Moderators direct Q&A flow|
|10:50 – 11:50|
Live Panel Session