• 2006, Dresden, Fireworks artist during welcome reception
  • 2006, Dresden, Keynote presentation
  • 2010, Greenwich, University Campus
  • 2016, Grenoble, Networking during break
  • 2014, Helsinki, Audience
  • 2016, Grenoble, Audience
  • 2016, Grenoble, Poster Presentation
  • 2008, Greenwich, Exhibition
  • 2008, Greenwich, Conference attendees
  • 2010, Berlin, Keynote
  • 2010, Berlin, Networking
  • 2014, Helsinki, Finlandia Hall
  • 2018, Dresden, PDC
  • 2018, Dresden, Conference dinner

Workshop - Heterogeneous Integration Roadmap (HIR)

Chaired by William Chen (ASE Group, USA), Rolf Aschenbrenner (Fraunhofer IZM Berlin, Germany) & Bill Bottoms (Third Millenium Test Solutions, USA)

 


The HIR workshop will be held as a Zoom webinar. You can register in advance here.


Heterogeneous Integration Roadmap (HIR)
Workshop @ ESTC 2020

September 15th 2020
9:00 am – 11:50 am
Live On-Line Workshop

The  Heterogeneous Integration Roadmap (HIR), released October 2019, is a roadmap to the future of electronics identifying technology requirements and potential solutions. The primary objective is to stimulate pre-competitive collaboration between industry, academia and government to accelerate progress. The roadmap offers professionals, industry, academia and research institutes a comprehensive, strategic forecast of technology over the next 15 years. The HIR also delivers a 25-year projection for heterogeneous integration of Emerging Research Devices and Emerging Research Materials with longer research-and-development timelines.

This HIR workshop @ESTC will feature selected topics from the HIR chapters including an overview presentation followed by a panel session addressing advancing Heterogeneous Integration in the Covid 19 era. The purposes for the HIR workshop at ESTC are to feature interest & stimulate collaboration for the HIR stakeholders around the world and particularly in Europe.

9:00 – 9:05     Welcome
9:05 – 9:30 HIR Overview 
9:30 – 10:50 HIR Chapters Highlight Session
  Session Moderators: Rolf Aschenbrenner & Bill Chen
9:30 – 9:40 SiP & Module (Erik Jung)
9:40 – 9:50 Integrated Photonics (Bill Bottoms)
9:50 – 10:00 Automotive Electronics (Andreas Grassmann)
10:00 – 10:10 MEMS & Sensor Integration (Jean-Charles Souriau)
10:10 – 10:20 Co-Design & Simulation (Chris Bailey)
10:20 – 10:30 5G (Kamal Samanta)
10:30 – 10:50 Live Q&A (20 Minutes) Moderators direct Q&A flow
10:50 – 11:50 

Live Panel Session
Theme:
Advancing Heterogeneous Integration in the Covid 19 era.
The Pace Quickens.

Moderators: Bill Bottoms & Jürgen Wolf
Panelists: CP Hung, Jan Vardaman, Laith Altimime, Eric Beyne, Ole Fredrik Morken