ESTC 2018 Sponsors
The Institute of Electronic Packaging Technology (IAVT) and the Centre for Microtechnical Manufacturing (ZmP) together represent one of the largest university research institutions in Germany active in the field of Electronic Packaging.
ASE offers services such as semiconductor assembly, packaging and testing. ASE provides semiconductor assembly and testing services for over 90 percent of electronics companies in the world.
Cicor Group offers complete outsourcing services and a broad range of innovative technologies, electronic manufacturing services and a wide range of production options from PCB assembly, system assembly, box-building, toolmaking and plastic injection molding.
Conference Bag Sponsor
Finetech manufactures innovative, high-accuracy equipment for leading-edge bonding, micro assembly and rework challenges. The FINEPLACER® systems are designed to be modular for maximum process flexibility and come in manual, semi-automatic or automatic configurations.
Ingenuity for life ensures the foundation for a strong economy, by mastering the challenges of today’s energy landscape. For example intelligent technologies ensure a stable power supply by managing fluctuations from wind and solar energy sources.
Lunch Buffet and Coffee Break Sponsors
Budatec GmbH produces equipment for the semiconductor and photovoltaic industries and is located in Berlin. The main business areas are thermal systems and electronic manufacturing products.
Deltec is a developer and manufacturer of electronic product for different customer applications.
For more than 20 years, digades develops and produces electronics solutions for a wide range of applications.
OPTICALLY POWERED MEASURING LUMILOOP develops and markets ready to use optically powered systems: from the sensor through the optical power and data transfer to the software - all from a single source.
The IEEE Electronics Packaging Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacturing.
The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education and training, interaction with industry and networking amongst professionals and academics.
OES e.V.: This network was founded on October 6th 2008 by seven companies and three research institutes from the organic sector in order to strengthen the organic center in Saxony and global.
Silicon Saxony is one of Europe‘s most successful trade association for the semiconductor, electronic, microsystems and software industries. The number of members has risen to more than 330 at present. The association links commercial enterprises, research institutes, universities and colleges.
Interested to support ESTC 2018 by Sponsoring?
ESTC 2018 offers different sponsor packages. The following ones are still available:
- Diamond Sponsor Package - 25.000 EUR
- Gold Sponsor Package - 15.000 EUR
- Silver Sponsor Package - 7.000 EUR
- Welcome Reception Sponsoring - 5.000 EUR
- Name Badge and Lanyard Sponsoring - 4.000 EUR
- Lunch Buffet and Coffee Break Sponsoring - 1.500 EUR
For more details check the Call for Sponsors.