Roadmap 300 mm Bosch-Fab Dresden
Otto Graf, Managing Director, Robert Bosch Semiconductor Manufacturing Dresden GmbH
“The new wafer fab is the biggest single investment in Bosch’s more than 130-year history,” said Dr. Volkmar Denner, chairman of the board of management of Robert Bosch GmbH. To satisfy the demand generated by the growing number of internet of things (IoT), connected mobility and applications relating to smart homes and smart cities, the new location in Dresden is to manufacture electronic components including wafer level tests based on silicon technologies using 12-inch wafers for application specific integrated circuits. Construction of the high-tech plant is to be completed by the end of 2019 followed by the installation of equipment by 3rd quarter 2019. Following a rollout phase, manufacturing operations will likely start at the end of 2021. Highly automated production lines with fully connected data sources will enable efficient manufacturing processes, ensure reliable delivery and help to reach benchmark quality.
The use of Artificial Intelligence (AI) will enable to set up one of the most advanced and intelligent semiconductor fab in the world. AI will improve capacity, quality, and efficiency and support results with lowest cycle time, highest productivity, fastest learning and more stable processes.
Total investment in the location will come to roughly one billion euros. As many as 700 new jobs are to be created in Dresden. With connectivity and automation growing, semiconductor and electronic components are being used in more and more areas of smart applications. By extending the semiconductor manufacturing capacity, Bosch is giving a sound basis for the future and strengthening its competitiveness and is going a very important step toward preserving and enhancing competitiveness. Bosch intends to collaborate closely with local companies, and in this way to reinforce not only Germany’s, but also Europe’s position as an industrial location.
Entering Siemens (Villach, Austria) in 1980, Otto Graf looks back on a long and extensive career in semiconductor environment. The graduated Electrical Engineer (HTL Klagenfurt, Austria) gained in-depth, hands-on experience working with nearly every inch-size of wafer (12’ to 4) and a wide range of semiconductor technologies (Memory, AISIC, MES, Power MOs). 1991, Otto Graf led a project team in a joint IBM Siemens cooperation, developing 16MB memory dies. From 1992 till 2012 he held different positions in the Siemens and later Infineon Technologies semiconductor facilities in Villach and Regensburg including the complete production management for both and deputy member of the Executive Board. 2012 Otto Graf moved to TDK Epcos, acting as the COO for business groups “aluminum capacitors” and “systems, acoustics, waves” till 2016. Since August 2017 Otto Graf is Managing Director of “Robert Bosch Semiconductor Manufacturing Dresden GmbH” and Project lead building up the new 300 mm wafer FAB of Bosch in Saxony.
Legal limits and opportunities for autonomous driving – how the law can influence innovation and competitiveness
Dr. jur Wolfgang Schneider, Attorney, Director Center Automotive Research CAR, University Duisburg-Essen
In the area of autonomous driving, technological development has moved far ahead of legal regulation. While in technical terms autonomous driving becomes more and more a reality, the law, in most parts of the world, does not allow autonomous vehicles, or only to a very limited extent. The exception are parts of the United States where, already today, autonomous vehicles can be homologated and registered like any other ‚ ordinary‘ vehicle. The presentation will show that different regulatory approaches can enhance, or limit, technological development. It concludes that the reserved and slow approach to autonomous driving in many parts of the world can result in a real competitive disadvantage. This conclusion is based on a thorough analysis of all legally relevant aspects of autonomous driving, including homologation, lawful driving, liability, insurance and data protection.
After successfully graduating in law at Frankfurt University (Germany), Wolfgang Schneider started his professional career as an assistant professor at the University of Frankfurt in 1975. From 1979 till 1982 he was General Counsel International at Rütgerswerke AG, Frankfurt. Between 1982 and 2014 Wolfgang Schneider held different positions at Ford Motor Company in Cologne (Germany), London (UK) and Detroit (USA), e.g. Senior Attorney, Vice President General Counsel and Member of the Board. Since 2015 Wolfgang Schneider is a free-lance attorney and teaches International Business Law at the University of Duisburg-Essen.
Key to 5G: Technology, Co-design and Collaboration
Jean M. Trewhella, Director of Packaging Technology Integration, GLOBALFOUNDRIES
5G applications demand extreme broadband, highly integrated, ultra low energy, cost effective solutions. GF´s 22FDX- SOI technology delivers FinFET-like performance and energy-efficiency at the cost of 28nm planar technologies. It is targeted to serve ultra low power, digital data processing and analog IP integration and allows system architects to design IP into one single SoCs. To package these mixed signal SoCs, our industry is facing complex challenges including integration of millimeter wave passives and high frequency antennas. This calls for new levels of chip package co-design and advanced packaging material and design characterization. In this talk, we will show how GlobalFoundries is driving collaborations to define system level EDA using a standardized reference design and validation flow effectively extending the well known silicon PDK (process design kit) approach.
Jean M. Trewhella is Director of Packaging Technology Integration for GLOBALFOUNDRIES, located in Malta, NY and the Jr. Past President of IEE EPS. She received her B.S. in Physics from Antioch College (1987) and M.S. in Applied Physics from Columbia University (1992). Her early career at IBM Research included polymer optical waveguides fabrication, electrical modeling, and opto-mechanical package design for data communication systems. She moved into IBM Systems Group where her team developed interconnection hardware for IBM servers and then into IBM Microelectronics as Director of IBM Packaging Research and Development Center delivering high performance first level packaging technology solutions.
Heterogeneous Integration - A Driver for Future Applications
Thorsten Meyer, Infineon Technologies
Heterogeneous Integration has become one of the major technology driving forces of microelectronic systems. It refers to the integration of separately manufactured components into a higher level of assembly which is providing enhanced functionality and operating characteristics. Heterogeneous Integration can be done on package level and on board or system level. The presentation will introduce to selected application fields and explain the new challenges and solutions for the packaging industry by practical examples for the different integration levels.
Thorsten Meyer is Principal Engineer Package Concept Engineering at Infineon Technologies in Regensburg, Germany, responsible for New Package Platforms and New Package Definition. Until March 2015 he was leading the Package Technology and Innovation department at Intel Mobile Communications (IMC) in Regensburg. Prior joining IMC, he was overall project leader for the development of Wafer Level Packaging Technologies at Infineon in Regensburg and earlier in Dresden. Thorsten Meyer is author of multiple publications and holds more than 140 patents and patent applications in the area of advanced packaging.