• 2006, Dresden, Fireworks artist during welcome reception
  • 2006, Dresden, Keynote presentation
  • 2010, Greenwich, University Campus
  • 2016, Grenoble, Networking during break
  • 2014, Helsinki, Audience
  • 2016, Grenoble, Audience
  • 2016, Grenoble, Poster Presentation
  • 2008, Greenwich, Exhibition
  • 2008, Greenwich, Conference attendees
  • 2010, Berlin, Keynote
  • 2010, Berlin, Networking
  • 2014, Helsinki, Finlandia Hall

Industrial Tours

ESTC 2018 offers couple of industrial tours on Friday, September 21st, 2018. Attending those tours is for free. Don't miss this opportunity to visit high level industrial and research facilities in Dresden. The number of participants per tour is limited. You can choose your favourite tour during conference registration.

The following tours will be available:



First Sensor Microelectronic Packaging GmbH

First Sensor Microelectronic Packaging GmbH (FSP) in Dresden has many years of experience and extensive expertise in developing and manufacturing everything from electronic micro systems for components to micro systems in the form of complex multi-chip modules for the customized miniaturization of optoelectronic and MEMS-based sensors. In ISO class 8 to 5 clean rooms, FSP manufactures semiconductor chips using the latest automated installation and connection technology methods. In addition to prototypes and small batches, this location also produces unit volumes in the millions and is certified in accordance with the ISO/TS 16949 and ISO 14001 quality management systems. The company possesses special skills in the processing of optical sensors, the assembly of large chips (> 10 x 10 cm) as well as the processing of chips with TSV technologies.

The ESTC 2018 industrial tour to First Sensor Microelectronic Packaging GmbH offers an introducing presentation about company facts, technologies and product portfolio. A detailed window tour through the production facility provides an insight into advanced packaging processes.

See more details about First Sensor.

Duration: 2 hours

Begin: September 21st, 2018, 9:30 a.m.

Bus transfer from and back to conference hotel will be available.


Fraunhofer IPMS

Fraunhofer Institute for Photonic Microsystems (Fraunhofer IPMS) develops for its customer’s products and technologies in the realm of microelectromechanical systems (MEMS), and micro-opto-electro-mechanical systems (MOEMS). Fraunhofer IPMS’ capabilities span the entire development arc for MEMS and MOEMS products and technologies. Upon request, Fraunhofer IPMS can either undertake in-house pilot and low-volume fabrication, or support technology transfer to a facility of the client's choice. In these endeavors, the institute uses its existing technological capabilities for bulk MEMS, surface MEMS, and the monolithic integration of CMOS and MEMS/MOEMS. This work is performed in a state-of-the-art MEMS clean room, capable of handling 200 mm wafers.

The ESTC 2018 industrial tour to Fraunhofer IPMS offers an introducing presentation about the institute. Detailed information in addition is provided after this by visiting the showroom and finally by a tour through the cleanroom facility.

See more details about Fraunhofer IPMS.

Duration: 2 hours

Begin: September 21st, 2018, 9:30 a.m.

Bus transfer from and back to conference hotel will be available.


SGS Institut Fresenius

SGS Institute Fresenius is one of Europe's leading providers of non-medical laboratory analysis. Our competence can be seen in our more than 180 certifications, accreditations and approvals and in our 155 years of experience in the field of analysis. This outstanding knowledge justifies our excellent reputation - in Germany and internationally - among manufacturers, the retail trade, service providers and end consumers. The work for those customers goes well beyond simply providing analytical laboratory services. SGS Institute Fresenius - with its analytical and advisory quality assurance competence - sees itself as a problem solver and advisor in the areas of product development, manufacture and processing.

The ESTC 2018 industrial tour to SGS Institute Fresenius Dresden offers an introducing presentation about the institute. A tour of the laboratory for chemical and physical analysis of electronic devices and other high-tech products provides an additional insight.

See more details about SGS Institut Fresenius.

Duration: 2 hours

Begin: September 21st, 2018, 9:30 a.m.

Bus transfer from and back to conference hotel will be available.


VW "Gläserne Manufaktur"

Established by Volkswagen in 2001 in the heart of Dresden, “Die Gläserne Manufaktur” is a unique assembly and exhibition centre as well as a hotbed for innovation and a lively place for exchange and engagement. The e-Golf has been made here since April 2017, and will soon be joined by more electric Volkswagen models. The e-Production tour gives visitors a fascinating, close-up view of how the cars are manufactured. The e-Exhibition introduces customers and other visitors to new ideas for the future of driving. As a Center of Future Mobility, Volkswagen is thereby turning “Die Gläserne Manufaktur” into true pioneers and trail blazers for electro mobility and new driving solutions.

The ESTC 2018 industrial tour to “Gläserne Manufaktur” offers a guided tour through the exhibition and the production facility with exciting impressions about the future of mobility.

See more details about "Gläserne Manufaktur".

Duration: 1.5 hours

Begin: September 21st, 2018, 9:30 a.m.

Bus transfer from and back to conference hotel will be available.


Institute of Electronic Packaging Technology and Centre for Microtechnical Manufacturing

The Institute of Electronic Packaging Technology (German abbrev. IAVT) is one of the Institutes of the Faculty of Electrical Engineering and Information Technology of Technische Universität Dresden. In 2003 the IAVT emerged from the former Electronics Technology Lab, continuing the expertise and summarizing the resources of the professorships „Process Technology of Electronics“, „Packaging“  and „Procedure Technology of Electronics“. The Centre for Microtechnical Manufacturing (German abbreviation ZmP) was founded in 1995. Since 1999 it is a central scientific institution of the Faculty of Electrical Engineering and Information Technology of Technische Universität Dresden. IAVT and ZmP are working together already more than 15 years in research and education. Together they represent one of the largest university research institutions in Germany active in the field of Electronic Packaging.

The ESTC 2018 industrial tour to IAVT/ZmP offers an introducing presentation about Technische Universität Dresden and a detailed lab tour through Werner-Hartmann-Building, the modern lab facility where IAVT/ZmP research and education equipment is located.

See more details about IAVT/ZmP.

Duration: 2 hours

Begin: September 21st, 2018, 9:30 a.m.

Bus transfer from and back to conference hotel will be available.