Next ESTC will take place from September 18th to 21st, 2018, in Dresden, Germany.
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ESTC is covering a wide range of up-to-date topics in electronics packaging and system integration. Presentations of leading edge research and development results related to those topics are welcome.
You want to submit an abstract for ESTC 2018? Your company is interested in joining the ESTC 2018 Exhibition? You want to support ESTC 2018 as a sponsor?
Get more information about it here.
Every ESTC is well prepared by an Executive Committee, supported by numerous volunteers of the local organizer.
If you are either an author who wants to submit an abstract/paper or a member of the Technical Committee, you need a login for getting access to restricted areas of this website.
For more information see details page.
Submit and manage your abstracts.
Note: This area is only accessible after succesful registration and login as an author.
Dresden, host of ESTC 2018, is the capital of Saxony and a city of science, art and business.
The conference venue for next ESTC will be The Westin Bellevue Dresden Hotel, a high class hotel right in the heart of the city of Dresden.