Next ESTC will take place from September 18th to 21st, 2018, in Dresden, Germany.
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ESTC is covering a wide range of up-to-date topics in electronics packaging and system integration. Presentations of leading edge research and development results related to those topics are welcome.
Every ESTC is well prepared by an Executive Committee, supported by numerous volunteers of the local organizer.
Dresden, host of ESTC 2018, is the capital of Saxony and a city of science, art and business.
The conference venue for next ESTC will be The Westin Bellevue Dresden Hotel, a high class hotel right in the heart of the city of Dresden.