• 2006, Dresden, Fireworks artist during welcome reception
  • 2006, Dresden, Keynote presentation
  • 2010, Greenwich, University Campus
  • 2016, Grenoble, Networking during break
  • 2014, Helsinki, Audience
  • 2016, Grenoble, Audience
  • 2016, Grenoble, Poster Presentation
  • 2008, Greenwich, Exhibition
  • 2008, Greenwich, Conference attendees
  • 2010, Berlin, Keynote
  • 2010, Berlin, Networking
  • 2014, Helsinki, Finlandia Hall

Technical Program Committee

The Technical Program Committee plays an important role in ensuring the quality of ESTC. Reviewing the submitted abstracts and papers and finally compiling an interesting and high-class technical program is only possible based on expert driven subcommittees.

The Technical Program Chair, coordinating the work of the subcommittees, changes from one ESTC to the next, while most of the subcommittee members already support ESTC for a long time. There is one subcommittee for each of the conference topics and one additional subcommittee responsible for the poster presentations. 


Technical Program Chair for ESTC 2018

Knut E. Aasmundtveit, University of South-East Norway


Advanced Packaging Subcommittee

  • Chair: Rolf Aschenbrenner, Fraunhofer IZM Berlin, Germany
  • Members:
    Eric Beyne, IMEC, Belgium
    Björn Böhme, Global Foundries Dresden, Germany
    Beth Keser, Intel Germany
    Mitsumasa Koyanagi, Tohoku Univ., Japan
    Steffen Kröhnert, Amkor Technology, Portugal
    Franck Murray, Murata, France
    Klaus Pressel, Infineon Technologies AG, Germany
    Ranjan Rajoo, Global Foundries, Singapore
    Hannes Stahr, AT&S, Austria
    Jan Vardaman, TechSearch, USA
    Jürgen Wolf, Fraunhofer IZM, Germany

Materials for Interconnects and Packaging Subcommittee

  • Chair: Johan Liu, Chalmers University Göteborg, Sweden
  • Co-Chair: Paul Conway, University of Loughborough, UK
  • Members:
    Stéphane Bellenger, Eolane, France
    Liqiang Cao, NCAP, China
    Brad Factor, ASE Group, France
    Jan Felba, University of Wroclaw, Poland
    Daniel Lu, Henkel, China
    James E. Morris, Portland State University, USA
    Kyung-Wook Paik, Kaist, Korea
    CP Wong, Georgia Tech, USA

Optoelectronic Systems Packaging Subcommittee

  • Chair:  Giovanni Delrosso, VTT, Finland
  • Co-Chair: Henning Schröder, Fraunhofer IZM, Germany
  • Members:
    YongSoon Baek, ETRI, Korea
    Stéphane Bernabé
    , CEA LETI, France
    Ulrich Fischer-Hirchert, Univ. of Appl. Sci., Germany
    Marika Immonen,
    TTM Technologies, Hong Kong
    Ignazio Piacentini,
    FiconTec, Germany 
    Mark Shaw, ST Agrate, Italy
    Maria Chiara Ubaldi,
    Fondazione CIFE, Italy

Assembly and Manufacturing Technologies Subcommittee

  • Chair: David Whalley, University of Loughborough, UK
  • Co-Chair: Andreas Ostmann, Fraunhofer IZM, Germany
  • Members:
    Knut E. Aasmundtveit, Vestfold Univ. College, Norway
    Gabriel Chindris, Technical University of Cluj Napoca, Romania
    Peter Collier, The Manufacturing Technology Centre, UK
    Michel Garnier, STMicroelectronics, France
    David Henry, CEA LETI Grenoble, France
    Maria Mirgkizoudi, Airbus Defense and Space GmbH, Germany

MEMS/NEMS and Sensors Packaging Subcommittee

  • Chair: Markku Tilli, Okmetic Oyl, Finland
  • Co-Chair: Mervi Paulasto-Kröckel, Aalto University, Finland
  • Members:
    Andre Cardoso, Amkor, Portugal
    Guangbin Dou, Imperial College London, UK
    Hemant Desai, Intel, USA
    Kevin Formosa, ST Microelectronics, Malta
    Oliver Krammer, Uni Budapest, Hungary
    Sami Nurmi, Murata Electronics, Finland
    Sebastian Schuler-Watkins, Bosch, Germany
    Gilles Simon, CEA LETI, France
    SW Yoon, STATSChipPAC, Singapore
    Christophe Zinck, ASE Group, France

Design Tools and Modeling Subcommittee

  • Chair: Chris Bailey, University of Greenwich, UK
  • Co-Chair: Rainer Dudek, Fraunhofer ENAS, Germany
  • Members:
    Laurent Bechou, ims Bordeaux, France
    Bernard Flechet, IMEP, France  
    Torsten Hauk, NXP, Germany
    Catalin Negrea
    , Continental Automotive, Romania
    Hossein Shirangi, Bosch, Germany  
    Anna Andonova, Technical University of Sofia, Bulgaria
    Stoyan Stoyanov, University of Greenwich, UK
    Bart Vandevelde, IMEC, Belgium
    Marcel Wieland, Global Foundries Dresden, Germany

Power Electronics System Packaging Subcommittee

  • Chair: Thomas Harder, ECPE European Center for Power Electronics, Germany
  • Members:
    Cyril Buttay, SuperGrid Institute, France
    Alberto Castellazzi, University of Nottingham, UK
    Kay Essig, ASE Group, Germany
    Andreas Fischer, Bosch, Germany
    Frank Osterwald, Danfoss Silicon Power, Germany
    Jelena Popovic-Gerber, Klimop Energy, The Netherlands
    Hervé Ribot, CEA LETI, France
    Jürgen Schuderer, ABB, Switzerland

Advanced Technologies for Emerging Systems Subcommittee

  • Chair: Klaus-Jürgen Wolter, Technische Universität Dresden, Germany
  • Co-Chair: Toni Mattila, Invest in Finland, Finland
  • Members:
    Severine Cheramy, CEA LETI, France
    Markus Detert, Univ. of Magdeburg, Germany
    Malgorzata Jakubovska, Warsaw University of Technology, Poland
    Ricky Lee, HKUST Hongkong, China
    Changqing Liu, Loughborough University, UK
    Martin Oppermann, TU Dresden, Germany
    Martin Schneider-Ramelow, Fraunhofer IZM, Germany
    Katsuaki Suganuma, Osaka University, Japan
    Thomas Zerna, TU Dresden, Germany

Reliability of Electronic Devices and Systems Subcommittee

  • Chair: Matthias Petzold, Fraunhofer IWM, Germany
  • Co-Chair: Kirsten Weide-Zaage, Leibniz University Hannover, Germany
  • Members:
    Ingrid De Wolf, imec, Belgium
    Xuejun Fan, Lamar University, USA
    Hélène Frémont, IMS Bordeaux, France
    Zhiheng Huang, Sun Yat-sen University, China (PRC)
    Karsten Meier, TU Dresden, Germany
    René Rongen, NXP, The Netherlands
    Vesa Vuorinen, Aalto University, Finland
    Olaf Wittler, Fraunhofer IZM, Germany

Flexible Printed and Hybrid Electronics Subcommittee

  • Chair:  Jukka Hast, VTT, Finland
  • Members:
    David Bird, National Centre for Printable Electronics, UK
    Karlheinz Bock, TU Dresden, Germany  
    Jeroen van den Brand, TNO, The Netherlands  
    Gyoujin Cho, Sunchon University, Korea
    Zheng Cui, Chinese Academy of Sciences, China  
    Johan Debaets, IMEC, Belgium
    Nenad Marjanovic, CSEM, Switzerland 
    Matti Mäntysalo, Tampere University of Technology, Finland
    Takao Someya, University of Tokyo, Japan  
    James J Watkins, Univ Massachusetts, USA

Poster Presentations Subcommittee

  • Chair: Hiroshi Nishikawa, Osaka University, Japan
  • Members:
    Derek Braden, Delphi Electronics & Safety, UK
    Dave Harvey, Liverpool John Moores Univesity, UK  
    Samjid Mannan, King's College London, UK  
    Jean Charles Souriau, CEA LETI, France
    Johanna Virkki, Tampere University of Tech., Finland