• 2006, Dresden, Fireworks artist during welcome reception
  • 2006, Dresden, Keynote presentation
  • 2010, Greenwich, University Campus
  • 2016, Grenoble, Networking during break
  • 2014, Helsinki, Audience
  • 2016, Grenoble, Audience
  • 2016, Grenoble, Poster Presentation
  • 2008, Greenwich, Exhibition
  • 2008, Greenwich, Conference attendees
  • 2010, Berlin, Keynote
  • 2010, Berlin, Networking
  • 2014, Helsinki, Finlandia Hall
  • 2018, Dresden, PDC
  • 2018, Dresden, Conference dinner

Conference Topics

ESTC is covering the following topics:

Advanced Packaging

Challenges and solutions in 3D integration, embedded structures, wafer level packaging, micro-bonding, TSVs, TEVs, advanced substrates and interposers

Materials for Interconnects and Packaging

New materials and processing - e.g. phase change, self-organizing, piezoelectric, dielectric and memory materials, nanomaterials, advanced interconnection metallurgies, adhesives in advanced interconnects

Optoelectronic Systems Packaging

Silicon photonics, Wafer Level Packaging and processes, Fiber optic and planar optical waveguides interconnections, optical sensors, LIDARs, OCTs, semiconductor tunable lasers packaging, O/E hybrid and heterogeneous integration at wafer level, LEDs and other solid state illumination device packaging

Assembly and Manufacturing Technologies

Novel assembly technologies, manufacturing aspects to novel packaging, wafer level processing

MEMS/NEMS and Sensors Packaging

Challenges and solutions in processing, integration and packaging, new packaging approaches, TSVs in MEMS, bonding technologies, wafer bonding, micro-bonding

Design Tools and Modeling

Thermal, mechanical and electrical modeling and experimental verifications, signal and power integrity

Power Electronic Systems Packaging

High performance packaging (low RDS(on), low Rth, high temperature), power embedding, very high voltage (>6.5kV) solutions, wide bandgap power semiconductor devices (e.g. SiC, GaN, GaAs), novel cooling solutions (e.g. double-sided cooling, bond-wire-less)

Advanced Technologies for Emerging Systems

Allotropes of carbon (CNTs, graphene, DLC, etc.), nanopackaging (nanoscaled materials, nanowires, nanointerconnects), emerging packaging concepts and technologies for bio-electronics, microfluidics, wearable electronics and sensors/actuators

Reliability of Electronic Devices and Systems

New results at different levels of system integration (chip contacts, packages, assemblies and subsystems), characterization and test, failure diagnostic, methodical and equipment developments, upcoming challenges due to new system integration demands, innovative materials and extended application fields

Flexible Printed and Hybrid Electronics

Printed/jetted (transparent) conductors, touch and large area sensors, signage and displays (e.g. LED, OLED, EL, electrochrome, electrophoretic), paper electronics, printed thin film PV and photodetectors, energy storage (batteries/supercapacitors) as well as flexible hybrid systems and processes integrating microelectronic components on flexible/stretchable substrates