The 6th edition of the ESTC (Electronics System-Integration Technology Conference) biennial conference, co-hosted by IEEE CPMT and CEA LETI, took place for the 1st time in France from 13th to 16th of September, 2016 at the World Trade Center in Grenoble. This conference is the most important event for the Packaging Electronic Components European community.
World-leading specialist and experts were able to exchange around 140 technical presentations divided into 28 technical sessions, 4 technical short-courses and 4 poster sessions. There were 38 exhibition booths and more than 450 participants including 350 for the only conference. The larger companies, institutes, IDM and OSATs in the field of the topic were represented (ASE, Amkor, GF, IBM, STMicroelectronics, Georgia Tech, CEA LETI, IZM, IMEC).
The conference welcomed 5 keynotes speakers (from CEA LETI, STMicroelectronics, Georgia Tech, ASE and IPDIA), one round table organized by iNEMI and the “IEEE CPMT Heterogeneous Integration Technology Roadmap“, also allowed to share roadmaps and emerging technologies. For the first time the IEEE CPMT Women’s Panel was organized about “Maximize Your Career Success”.
Among the many highlight of the conference, the Gala dinner was organized at the “Chateau du Touvet”. The house (of the 18th century) and its garden are both classified as “Monument Historique” (listed building). It was the opportunity to appreciate a musical break in the Music Room. During the dinner, it was also the opportunity for CPMT Region 8 Chapter to reward Professor Zsolt Illyefalvi-Vitéz, winner of the 2016 Regional Contributions Award and Professor Paul Svasta, winner of the 2015 award.
During the closure session the conference awarded the best paper. It has been presented to Olivier Castany, Benjamin Blampey, Benoit Charbonnier, Gabriel Pares, Maxime Germain, Isabelle Borel, Stephane Malhouitre, Christophe Kopp and Stephane Bernabe from CEA LETI and Enrico Temporiti (STMicroelectronics) for their presentation “Packaging of high speed 100 Gbps Silicon Photonic Photo-receiver module using 50 µm pitch micro bump Flip Chip and Chip on Board approach”.
The best poster has been awarded to Aitzaz Kazmi, Muhammad Rizwan, Lauri Sydänheimo, Leena Ukkonen, Johanna Virkki from Tampere University of Technology for the poster “A Reliability Study of Coating Materials for Brush-painted Washable Textile RFID Tags”.
We would like to thank all the participants for ensuring ESTC 2016 and look forward to what will surely be another standout ESTC in Dresden in 2018.
|Jean Marc Yannou|
Technical Program Chair
Technische Universität Dresden