Organized by IEEE-EPS (former CPMT) since 2006 Electronics System-Integration Technology Conferences (ESTC) series is the premier venue for academics and industry to present and discuss the latest developments in electronics packaging.

ESTC is covering a wide range of up-to-date topics in electronics packaging and system integration. Presentations of leading edge research and development results related to those topics are welcome.

Strategic decisions about the further development of ESTC as the premier IEEE-EPS conference in Europe are made by the Steering Committee.

Ensuring a high quality conference with an interesting technical program is onlx possible with the help of many experts worldwide active in the Technical Program Committee

Since 2006 ESTC moves around in Europe and is organized every two years by a different hosting institution. See where previous ESTC has been held and read more about those events.