ESTC2022: About ESTC

2006, Dresden, Fireworks artist during welcome reception
2006, Dresden, Keynote presentation
2008, Greenwich, University Campus
2016, Grenoble, Networking during break
2014, Helsinki, Audience
2016, Grenoble, Audience
2016, Grenoble, Poster Presentation
2008, Greenwich, Exhibition
2008, Greenwich, Conference attendees
2010, Berlin, Keynote
2010, Berlin, Networking
2014, Helsinki, Finlandia Hall
2018, Dresden, PDC
2018, Dresden, Conference dinner
2020, Vestfold, Virtual HIR workshop panelists
2020, Vestfold, Virtual conference chairing
2022, Sibiu, Exhibition
2022, Sibiu, Plenary Session
2022, Sibiu, Gala Dinner

ESTC 2022 Proceedings published

The ESTC 2022 Proceedings are now available in IEEE Xplore.

Follow https://ieeexplore.ieee.org/xpl/conhome/9939139/proceeding.

Mission

Organized by IEEE-EPS (former CPMT) since 2006 Electronics System-Integration Technology Conferences (ESTC) series is the premier venue for academics and industry to present and discuss the latest developments in electronics packaging.

Topics

ESTC is covering a wide range of up-to-date topics in electronics packaging and system integration. Presentations of leading edge research and development results related to those topics are welcome.

Steering Committee

Strategic decisions about the further development of ESTC as the premier IEEE-EPS conference in Europe are made by the Steering Committee.

TP Committee

Ensuring a high quality conference with an interesting technical program is only possible with the help of many experts worldwide active in the Technical Program Committee

Committee Area

Committee specific features of the website.

Note: This area is only accessible after succesful login as a committee member.

History

Since 2006 ESTC moves around in Europe and is organized every two years by a different hosting institution. See where previous ESTC has been held and read more about those events.

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Supporting Organizations

ESTC 2022 Local Organizers

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