Abstract submission deadline has been extended till February 5th!
It is our pleasure to welcome you to the 6th Electronics System-integration Technology Conference and Exhibition (ESTC), the premier European event in the field of microelectronics packaging and integration. The conference will be held 13th – 16th of September, 2016, at the World Trade Center in Grenoble, France. This international event brings together both academic as well as the industry leaders to discuss and debate about the state-of-the-art and future trends in packaging and integration technologies.
The 2016 conference continues a line of prestigious events since the birth of the conference in 2006 in Dresden, Germany. The ESTC conference program consists of technical short courses from the leading experts, invited keynote talks from industry leaders, panel discussions, technical sessions, and a technical exhibition.
With kind regards,