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ESTC 2016 - Up to date information

Welcome to the ESTC 2016 Conference in Grenoble, France

Dear reader,

It is our pleasure to welcome you to the 6th Electronics System-integration Technology Conference and Exhibition (ESTC), the premier European event in the field of microelectronics packaging and integration. The conference will be held 13th – 16th of September, 2016, at the World Trade Center in Grenoble, France. This international event brings together both academic as well as the industry leaders to discuss and debate about the state-of-the-art and future trends in packaging and integration technologies.

The 2016 conference continues a line of prestigious events since the birth of the conference in 2006 in Dresden, Germany. The ESTC conference program consists of technical short courses from the leading experts, invited keynote talks from industry leaders, panel discussions, technical sessions, and a technical exhibition.

With kind regards,

Gilles Poupon
General Chair
CEA LETI, France

Jean-Marc Yannou
Executive Chair
ASE Group, France

Karlheinz Bock
Technical Program Chair
TU Dresden, Germany

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