ESTC 2010 is your chance to present your research results to a high-caliber professional audience. Meet up with key researchers, decision-makers and standards bodies working in microelectronic packaging.

Please submit your abstract for a paper or a poster by February 15, 2010 at the latest. To submit online follow the authors instructions.

Join the concurrent exhibition and make Berlin your gateway to Europe by meeting representatives of all the major European players from industry (e.g. Bosch, Infineon, Henkel, Nokia, NXP Semiconductors, Philips, Pirelli, Siemens, ST Microelectronics) and the key research centers (e.g. Fraunhofer, IMEC, LETI). Use the opportunity to present your products and services to a select expert audience!