5th Electronics System-Integration Technology Conference
September 16 – 18, 2014
Finlandia Hall, Helsinki, Finland
Due to multiple requests the abstract submission deadline for ESTC 2014 has been extended to February 28th!
Use this chance to join Europes no. 1 IEEE-CPMT packaging conference as an author.
Organized by IEEE-CPMT since 2006, the Electronics System-Integration Technology Conferences (ESTC) series is the premier venue for academics and industry to present and discuss the latest developments in assembly and interconnection technology and new applications.
ESTC completes the triumvirate together with ECTC in the United States and EPTC in Singapore and thus supports the global community of electronics packaging engineers and scientists.